Wafer cutting machine

Wafer cutting machine

  • DISCO wafer cutting machine DFL7341

    DISCO wafer cutting machine DFL7341

    Maximum workpiece size mm ø200Processing method Fully automaticX-axis effective feed speed range mm/s 1.0 - 1,000Y-axis positioning accuracy mm within 0.003/210Dimensions (WxDxH) mm 950 x 1,732 x 1,80...

    State:Used In stock:have Warranty:supply
  • DISCO Fully Automatic Dicing Saw DFD6341

    DISCO Fully Automatic Dicing Saw DFD6341

    Equipment size‌: 1.180 meters wide, 1.080 meters deep, 1.820 meters high‌. ‌Equipment weight‌: about 1.500 kilograms‌. ‌Maximum processing object size‌: Φ8 inches (about 200 mm)‌. ‌Spindle configurati...

    State:Used In stock:have Warranty:supply
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