DISCO DAD323 is a high-performance automatic dicing machine suitable for diversified processing from semiconductor wafers to electronic components
DAD324 uses a high-performance MCU to improve software operation speed and operation response speed. The X, Y, and Z axes all use servo motors to increase axis speed and production efficiency. The sta...
DISCO-DAD3230 is an automatic cutting machine, mainly used for cutting operations of processed objects
DISCO-DAD3241 is a high-performance automatic slicer suitable for cutting needs of various materials with high productivity and high precision
ASM Laser Cutting Machine LS100-2 is a laser scribing machine designed for high-precision cutting needs, especially suitable for the manufacture of Mini/Micro LED chips
ASM laser cutting machine LASER1205 is a high-performance laser cutting equipment
Maximum workpiece size mm ø200Processing method Fully automaticX-axis effective feed speed range mm/s 1.0 - 1,000Y-axis positioning accuracy mm within 0.003/210Dimensions (WxDxH) mm 950 x 1,732 x 1,80...
Equipment size: 1.180 meters wide, 1.080 meters deep, 1.820 meters high. Equipment weight: about 1.500 kilograms. Maximum processing object size: Φ8 inches (about 200 mm). Spindle configurati...
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Wafer cutting machine FAQ
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Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
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