Asmpt Crystal Bonding Machine Motherboard

The die bonder motherboard is the core control unit of the die bonder, responsible for the operation and coordination of the entire device. Its main functions include:

‌Control various actions of the die bonder: such as chip placement, copper wire welding, solder joint detection, etc.

‌Data processing and communication: Process data from sensors and operating interfaces, and communicate with external devices.

‌Visual positioning system: Ensure the accuracy of the die bond through the dual visual positioning system.

The technical specifications and performance indicators of the die bonder motherboard directly affect the stability and production efficiency of the equipment. The main technical specifications include:

‌Welding speed: The welding speed directly affects the production efficiency and is an important performance indicator.

‌Welding quality: The welding quality determines the reliability of the chip.

‌Equipment stability: Equipment stability is related to the stability of the production line and the life of the equipment.