Semiconductor equipment
Asmpt ball welding machine splitter

Asmpt ball welding machine splitter

Asmpt ball bonder splitter‌ plays an important role in the field of microelectronic packaging and is mainly used for cutting transistor wafers in ball bonder machines.

State:New In stock:have Warranty:supply
Details

Asmpt ball welding machine splitters are mainly divided into the following types:

‌Manual splitter‌: Manual operation, suitable for small batch production, simple operation, and relatively cheap price.

‌Semi-automatic splitter‌: Semi-automatic operation, suitable for medium batch production, simple operation, and high efficiency.

‌Fully automatic splitter‌: Fully automatic operation, suitable for large batch production, easy operation, and high efficiency.

‌Laser splitter‌: Using laser technology, suitable for high-precision, large-scale production, high precision, and high efficiency.

The basic steps for using the Asmpt ball welding machine splitter include:

‌Preparation‌: Place the wafer on the splitter, adjust the position and angle of the splitter, and turn on the power of the splitter.

‌Start splitting‌: Select manual, semi-automatic or fully automatic mode as needed, place the splitter in the specified position, start the splitter, and start splitting.

‌Quality inspection‌: After splitting, the split wafer needs to be quality inspected to ensure that it meets the requirements.

‌Cleaning and maintenance‌: After splitting, the splitter needs to be cleaned and maintained to ensure its normal use‌

splitter

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