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The main functions and roles of the ASM IC packaging machine IDEALab 3G include the following aspects:
High-density solution: IDEALab 3G is suitable for R&D and trial production of special single-beer molding systems, providing high-density packaging solutions with a size of 100mm wide x 300mm long.
Single-beer configuration: The equipment provides two optional configurations of 120T and 170T, suitable for different production needs.
SECS GEM function: IDEALab 3G has SECS GEM function, which improves the automation and integration of the production process.
Advanced packaging technology: The equipment supports a variety of advanced packaging technologies, such as UHD QFP, PBGA, PoP and FCBGA, etc., suitable for various packaging needs.
Scalable modules: IDEALab 3G supports a variety of scalable modules, such as FAM, electric wedge, SmartVac and SmartVac, etc., which further enhances the flexibility and functionality of the equipment.
Application and Importance of ASM IC Packaging Machine in Semiconductor Packaging:
Chip Mounting: The chip mounter is one of the most critical equipment in the semiconductor packaging process. It is mainly responsible for grabbing the chip from the wafer and placing it on the substrate, and using silver glue to bond the chip and the substrate. The accuracy, speed, yield and stability of the chip mounter are crucial to the advanced packaging process.
Advanced Packaging Technology: With the development of semiconductor technology, advanced packaging technologies such as 2D, 2.5D and 3D packaging have gradually become mainstream. These technologies achieve higher integration and performance by stacking chips or wafers, and equipment such as IDEALab 3G plays an important role in the application of these technologies.
Market Trends: With the continuous advancement of semiconductor technology, the demand for advanced packaging equipment is also increasing. High-density and high-performance packaging equipment such as IDEALab 3G has broad application prospects in the market
