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The ASM LED Automated Packaging Machine AD838L is a high-performance LED packaging device designed to meet the demands of modern electronics industries for precision, efficiency, and automation. Whether for large-scale production or small-batch customization, the AD838L offers superior packaging solutions.
packaging machine Key Features & Benefits
Automation: The AD838L integrates advanced automation technology, significantly reducing manual intervention and enhancing production efficiency.
High Precision: The machine ensures the stability and consistency of LED packaging, with high precision in every process.
Multi-Function Adaptability: It accommodates various LED packaging types, improving flexibility in production.
High-Speed Production: Capable of handling large volumes with a reduced production cycle time, increasing overall output.
Leading Technology in Packaging: The AD838L is at the forefront of packaging machine technology, addressing the diverse needs of the LED industry.
Technical Specifications
Packaging Types: Suitable for various LED packaging forms, including SMD and COB.
Production Capacity: Can handle up to 1000~2000 LED units per hour.
Precision: Achieves accuracy down to ±10um microns, ensuring consistent quality.
Operating Temperature: Designed to function optimally in a wide range of environmental conditions.
Single-beer configuration: The equipment provides two optional configurations of 120T and 170T, suitable for different production needs.
SECS GEM function: AD838L has SECS GEM function, which improves the automation and integration of the production process.
High-density solution: AD838L is suitable for R&D and trial production of special single-beer molding systems, providing high-density packaging solutions with a size of 100mm wide x 300mm long.
Scalable modules: AD838L supports a variety of scalable modules, such as FAM, electric wedge, SmartVac and SmartVac, etc., which further enhances the flexibility and functionality of the equipment.
Applications
The ASM LED Packaging Machine AD838L is ideal for packaging LED products used in:
LED bulbs
LED displays
LED backlighting systems This packaging machine is the perfect solution for industries requiring high-speed, high-precision, and flexible production lines.
Customer Testimonials
“After using the ASM LED Packaging Machine AD838L, our production efficiency increased by 30%, and the stability of our product quality improved significantly.”
Why Choose ASM LED Packaging Machine AD838L?
Energy-Efficient: The AD838L utilizes energy-saving technologies to help businesses reduce operating costs.
High Automation: With reduced manual handling, it enhances efficiency and product consistency.
Precision Packaging: Ensures the quality of every LED unit, extending the lifespan of LED products.
Support & After-Sales Service
We offer comprehensive technical support and 24/7 online service for the ASM LED Packaging Machine AD838L, ensuring long-term, reliable performance.
The main functions and roles of the ASM IC packaging machine AD838L include the following aspects:
High-density solution: AD838L is suitable for R&D and trial production of special single-beer molding systems, providing high-density packaging solutions with a size of 100mm wide x 300mm long.
Single-beer configuration: The equipment provides two optional configurations of 120T and 170T, suitable for different production needs.
SECS GEM function: AD838L has SECS GEM function, which improves the automation and integration of the production process.
Advanced packaging technology: The equipment supports a variety of advanced packaging technologies, such as UHD QFP, PBGA, PoP and FCBGA, etc., suitable for various packaging needs.
Scalable modules: AD838L supports a variety of scalable modules, such as FAM, electric wedge, SmartVac and SmartVac, etc., which further enhances the flexibility and functionality of the equipment.
Application and Importance of ASM IC Packaging Machine in Semiconductor Packaging:
Chip Mounting: The chip mounter is one of the most critical equipment in the semiconductor packaging process. It is mainly responsible for grabbing the chip from the wafer and placing it on the substrate, and using silver glue to bond the chip and the substrate. The accuracy, speed, yield and stability of the chip mounter are crucial to the advanced packaging process.
Advanced Packaging Technology: With the development of semiconductor technology, advanced packaging technologies such as 2D, 2.5D and 3D packaging have gradually become mainstream. These technologies achieve higher integration and performance by stacking chips or wafers, and equipment such as IDEALab 3G plays an important role in the application of these technologies.
Market Trends: With the continuous advancement of semiconductor technology, the demand for advanced packaging equipment is also increasing. High-density and high-performance packaging equipment such as AD838L has broad application prospects in the market
