ASMPT Laminator IDEALmold™ 3G is an advanced automatic molding system, especially suitable for processing strip and roll substrates
ASMPT IdealMold™ R2R Laminator is a programmable molding system for single or double roll molding with vertical glue injection packaging technology (PGS™), especially suitable for ultra-thin packages...
ASM IC packaging machine Idealab 3G is a die bonding machine designed for R&D and pilot production, with high-density solutions and a variety of scalable modules
BESI's AMS-X mold machine is an advanced servo hydraulic molding machine with many advantages and features
BESI's MMS-X mold machine is a manual version of the AMS-X mold machine. It uses a newly developed plate press with an extremely compact and rigid structure to obtain a perfect, flash-free end p...
The FML function of the BESI molding machine is mainly used for precise control and management during the packaging and electroplating process.
The main function of BESI’s AMS-LM machine is to process large substrates and provide high productivity and good performance and output. The machine is capable of processing 102 x 280 mm substrates ...
AMS-i in BESI molding machine is an automated assembly and test system produced by BESI. BESI is a semiconductor and microelectronics manufacturing equipment company headquartered in the Netherlands...
Features●Independent packaging equipment, suitable for both die up and die down wafer level and substrate packaging●Suitable for KOZ and overmold products●Can use powder and liquid packaging resin. Au...
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Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
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