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AD211 Plus fully automatic eutectic machine is an advanced packaging equipment, mainly used for eutectic and die bonding processes. The equipment has a wide range of applications in the semiconductor industry, especially in the packaging of automotive headlight light sources, UVC, optical communications and other fields.
Main uses and functions
The AD211 Plus fully automatic eutectic machine is mainly used for eutectic and die bonding processes, and is suitable for a variety of application scenarios, including but not limited to the packaging of automotive headlight light sources, UVC (ultraviolet C) and optical communication equipment. Its high precision and high efficiency make it perform well in these fields.
Technical parameters and performance characteristics
High precision: AD211 Plus has high-precision die bonding capabilities, which can ensure the precise combination of chips and substrates. High efficiency: The design of the equipment has significantly improved its die bonding speed and placement accuracy, which is suitable for high-density packaging needs. Automation: The equipment has automation functions, which can automatically convert welding and automatically switch wafers to meet different packaging needs.
