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ASMPT high-precision fully automatic die bonding machine AD280 Plus

Features●Accuracy ± 3 µm @ 3s●Glue dispensing/jetting for die bonding●Material source traceability for enhanced quality control●Patented soldering head design●Up to 8” x 8” substrate handling●Options●Flip chip capability●UV curingDimensionsW x D x H2,150

State:Used In stock:have Warranty:supply

Quick Request Email:smt-sales6@gdxinling.cn

Details

The high-precision fully automatic die bonder AD280 Plus is an automated high-precision die bonder with the following main features and functions:

High-precision positioning: AD280 Plus has patented perspective image recognition technology, which can achieve an XY positioning accuracy of ±3 µm@3σ.

Multiple material handling capabilities: The device supports multiple material handling, including wafers on expanders or clamping rings, optional format trays, Gelpak, tape feeders, etc.

Traceability: Improve product traceability through barcodes, QR codes or OCR technology on panels/wafers/chips.

Die bond force control: Equipped with a die bond force sensor, the die bond force can be accurately controlled.

Fast UV curing: Supports spot curing and panel curing, suitable for applications such as PCB/COB transceiver packaging.

Applicable fields and industries

AD280 Plus is suitable for IC packaging equipment, especially for advanced packaging. It is widely used in semiconductor manufacturing and packaging processes, and can significantly improve packaging efficiency and yield.

AD280-PLUS