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It is a fully automatic die bonder designed for integrated circuit and discrete component applications. It combines the advantages of ultra-fast and high-precision, and is equipped with a glue dripping control system, suitable for processing 12-inch wafer die bonding.
Main features
High production capacity : The AD8312 series die bonder sets a new standard for high production capacity, with an hourly output of up to 17,000 pieces .
High precision : The XY soldering position accuracy is ±20 μm @ 3σ in standard mode and ±12.5 μm @ 3σ in precision mode .
Universal workpiece table design : Suitable for processing high-density lead frames, with a variety of configurations to meet different market needs .
Image recognition system : Equipped with an advanced image recognition system iFlash, it improves the accuracy of die bonding 1.
Application areas
The AD8312 Plus is suitable for applications in integrated circuits and discrete components, especially for processing high-density lead frames and various packaging requirements .
