Fully automatic die bonding and flip chip system AD838L plus

Detailed introduction:

Fully automatic die bonding and flip chip system

■Unique carrier-type material handling capability, especially suitable for 8'' fragile and scratch-prone substrates

■Zhuanli process technology, +25μm/+15um_upward accuracy can still maintain high hourly production capacity of 12K/H.

■Automatic material handling capability (optional)

■Automatic wafer loading and unloading system (optional)

■Automatic switching nozzles 4 (optional)

■FC flip chip processing capability (optional)

■Spray glue disc for pre-spraying (optional)

■1 barcode reader (optional), online (optional)

■Support reverse feeding to handle mixed core packaging products

■Linear motor driven XY double glue system, used for various silver pastes, conductive or non-conductive glues

■Rotary nozzle welding arm system replaces the rotating wafer table correction chip