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The fully automatic ASMPT die bonder system AD832I is a fully automatic high-speed silver paste die bonder designed for small devices and capable of handling a variety of device types such as QFN, SOT, SOIC, SOP, etc. It has the following main features:
Ultra-micro dispensing capability: Capable of handling ultra-small wafers, suitable for high-density lead frame handling.
Patented welding head design: The patented welding head design improves the stability and efficiency of welding.
Dual glue drop system: Equipped with a dual glue drop system, it can better control the amount and accuracy of glue used.
Real-time graphical statistics: The latest IQC system provides real-time graphical statistics for users to monitor and adjust the production process.
These features make the AD832i perform well in the 8-inch (200 mm) die bond process, especially suitable for production environments that require high efficiency and high precision.
