ASMPT's SD8312 fully automatic soft solder die bonder system is an advanced device designed for 12-inch wafer processing, with high-density lead frame processing capabilities and leading die bonding speed. The system is suitable for the power semicon
SD8312 fully automatic soft tin ASM die bonder system
Features
●The new generation SD8312 series sets a new standard for 12” soft tin die bonder
●Universal worktable design, capable of handling high-density lead frames
●High-speed die bonder combining innovative high-tech and mature process technology
●Precise control of oxygen levels during die bonding
●AB wafer processing capabilities
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