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ASM die bonding machine AD800 is a high-performance, fully automatic die bonding machine with many advanced functions and features. The following is its detailed introduction:
Main features
Ultra-high-speed operation: The cycle time of the AD800 die bonding machine is 50 milliseconds, which significantly improves production efficiency.
High-precision positioning: XY position accuracy is ±25 microns, and mold rotation accuracy is ±3 degrees, ensuring high-precision die bonding operations.
Wide Application Range: Able to handle small molds (as low as 3 mil) and large substrates (up to 270 x 100 mm), suitable for a variety of application scenarios.
Comprehensive quality inspection: Equipped with defect inspection, comprehensive quality inspection functions before and after bonding to ensure product quality.
Automated functions: Automatically skip units and molds, inking or poor quality functions, and inspection functions before and after bonding, further improving production efficiency and product quality.
Energy-saving design: Using linear motor design, it reduces maintenance costs and has the characteristics of energy saving and low power consumption.
High production efficiency: High UPH (output per hour) and occupancy ratio improve the utilization of factory space.
Technical parameters
Dimensions: Width, depth and height 1570 x 1160 x 2057 mm.
Application scenarios
AD800 die bonding machine is suitable for various application scenarios of chip packaging equipment, especially in the field of semiconductor packaging. It can handle multiple types of substrates and molds to meet different production needs.
