ASM die bonder AD819 is an advanced semiconductor packaging equipment used to accurately place chips on substrates and is a key device in the automated die bond process
ASM die bonder AD819 is an advanced semiconductor packaging equipment used to accurately place chips on substrates and is a key device in the automated die bond process
AD819 Series Fully Automatic ASMPT Die Bonding System
Features
●TO-can packaging processing capability
●Accuracy ± 15 µm @ 3s
●Eutectic die bond process (AD819-LD)
●Dispensing die bond process (AD819-PD)
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