Our die bonding equipment is engineered for precision, speed, and versatility, allowing manufacturers to enhance productivity while maintaining the highest quality standards. Whether you are producing consumer electronics, automotive components, or industrial sensors, our equipment ensures superior performance and reliability.
ASM die bonder AD819 is an advanced semiconductor packaging equipment used to accurately place chips on substrates and is a key device in the automated die bond process
ASM AD800 is a high performance fully automatic die bonder with many advanced functions and features
The working principle of the ASM die bonder AD50Pro mainly includes heating, rolling, control system and auxiliary equipment.
AD420XL provides high-speed, high-precision pick and place Mini LED COB solutions for large-size LCD BLUs (for local dimming) and ultra-fine pitch LED displays, with small chip handling capabilities, ...
ASMPT's SD8312 fully automatic soft solder die bonder system is an advanced device designed for 12-inch wafer processing, with high-density lead frame processing capabilities and leading die bond...
The specifications and dimensions of the ASMPT fully automatic die bonding system are as follows:Dimensions: W x D x H 1,970 x 1,350 x 2,190 mm
The AD838l plus fully automatic disk bonding and flip chip system is a high-precision and high-efficiency die bonding equipment, mainly used for the automated production of semiconductor packaging an...
Features● New generation high-capacity AD8312 series die bonders set new standards for the industry● Universal worktable design, suitable for processing high-density lead frames● Available in multiple...
Features●Accuracy ± 3 µm @ 3s●Glue dispensing/jetting for die bonding●Material source traceability for enhanced quality control●Patented soldering head design●Up to 8” x 8” substrate handling●Options●...
Features●Accuracy ± 12.5 µm @ 3s●Can directly process ceramic substrates●Masterful process and module design●Independent control of crystal retrieval and crystal bonding systems●Equipped with IQC syst...
MRSI Systems Die Bonder is a product of the Mycronic Group, which focuses on providing fully automatic, high-precision, ultra-flexible die bonding systems, which are widely used in the optoelectroni...
Besi Datacon 8800 is an advanced chip bonding machine, mainly used for 2.5D and 3D packaging technology, especially TSV (Through Silicon Via) applications
Our clients are all from large publicly listed companies.
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Die Bonding Equipment FAQ
MORE+In today’s fast-paced world of electronics manufacturing, staying ahead of the competition requires
Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
In the electronics manufacturing industry, choosing the right SMT machine (Surface Mount Technology)
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