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High test accuracy: AUTOPIA-TCT has a test FOV (Field of View) of up to 2100, which can provide high-precision test results.
High degree of freedom: The equipment has 11 degrees of freedom, which improves the calibration quality and ensures the accuracy of the test.
Highly configurable: The equipment provides a wide range of user-defined process parameters to adapt to different production needs.
Efficient production: The sensor leveling function greatly improves the calibration results, and the automatic and precise loading/unloading function supports mass production.
Flexible expansion: The equipment can be expanded for online production, and the production cleanliness reaches Class 100, which is suitable for high-cleanliness production environments.
Application scenarios and market needs
AUTOPIA-TCT equipment is mainly used in the field of wafer semiconductor packaging, suitable for large-volume or large UPH (Units Per Hour) production sequences, and can easily switch between different production sequences to meet diverse market needs. Its high precision and efficient production capabilities give it broad application prospects in the semiconductor packaging industry.
