Amplitude Satsuma X is a high-power ultrafast thin-disk laser launched by Amplitude of France. It uses revolutionary thin-disk amplifier technology to achieve kilowatt-level average power output while maintaining femtosecond pulse accuracy, redefining the power boundary of industrial ultrafast processing.
2. Breakthrough working principle
1. Thin-slice amplifier architecture
Gain medium: Yb:YAG crystal thin slice (thickness <200μm)
Surface area/volume ratio is 100 times that of traditional rod lasers
Supports multi-pass pumping (16 energy extractions)
Thermal management advantages:
Thermal gradient <0.1°C/mm (traditional rod lasers >5°C/mm)
Theoretical thermal lens effect approaches zero
2. Multi-stage amplification system
Seed source: fiber oscillator (pulse width <300fs)
Pre-amplification stage: fiber CPA system (pulse stretching to 2ns)
Main amplifier stage: thin-slice multi-pass amplifier (single pulse energy >50mJ)
Compressor: grating pair compresses back femtosecond pulses
3. Real-time control technology
Adaptive optical system:
Deformable mirror corrects wavefront distortion (accuracy λ/10)
Real-time pulse diagnosis (FROG technology integration)
Intelligent power management:
Automatically adjust pulse train parameters according to material reflectivity
Power fluctuation <±0.8% (8 hours of continuous operation)
III. Industry-leading advantages
1. Power-precision balance
Parameters Satsuma X HP3 Traditional disk laser
Average power 1kW 500W
Single pulse energy 50mJ 20mJ
Processing speed of aluminum foil 15m/min (0.1mm thick) 8m/min
Heat-affected zone <5μm <10μm
2. Breakthrough in industrial applicability
7×24 continuous operation:
Adopt optical glue-free design (anti-vibration>5G)
MTBF of key components>30,000 hours
Intelligent maintenance system:
Predictive maintenance reminder (based on AI algorithm)
Modular replacement (optical components<30 minutes)
3. Material processing advantages
High-reflective metal processing:
Copper welding depth-to-width ratio of 20:1 (conventional technology <10:1)
Gold foil cutting without melt beads (speed>20m/min)
Transparent material processing:
Glass internal modification quality control accuracy ±0.5μm
Sapphire cutting taper <0.1°
IV. Scenarii tipice de aplicare
1. New energy battery manufacturing
Tăierea urechii stâlpului:
8μm copper foil cutting speed of 30m/min
Edge burr-free (Ra<0.5μm)
Battery shell welding:
Aluminum alloy welding penetration of 10mm
Porosity <0.01%
2. Aerospace
Turbine blade cooling hole:
High-temperature alloy micropores (Φ50μm depth-to-diameter ratio 50:1)
No recast layer (fatigue life increased by 3 times)
Composite material processing:
CFRP non-delamination cutting (heat-affected zone <3μm)
3. Precision electronics
Flexible circuit processing:
PI film cutting accuracy ±2μm
Minimum line width 15μm
Semiconductor packaging:
Glass through-hole (TGV) processing efficiency increased by 5 times
V. Technical comparison advantages
Comparison items Satsuma X US competitor German competitor
Power scalability 1.5kW design 800W upper limit 1kW upper limit
Pulse flexibility 0.1-10ps adjustable Fixed pulse width Limited adjustment
Footprint 1.2m² 2m² 1.8m²
Energy consumption ratio 1.0 1.3 1.2
VI. Service support system
Global application laboratories: France/USA/Japan/China (Shanghai)
Process development package: Provides 100+ material processing parameter libraries
Remote diagnosis: 5G network real-time troubleshooting
Satsuma X successfully solved the "thermal bottleneck" problem of ultrafast lasers in the high-power field through the deep integration of thin-film amplification technology and intelligent control, and became a transformative tool for strategic industries such as aerospace and new energy. Its modular design also reserves technical space for future upgrades to 1.5kW.