The main features of Samsung SMT 411 include its high speed, high precision and high efficiency.
Speed and Precision
The placement speed of Samsung SMT 411 is very fast, and the placement speed of chip components can reach 42,000 CPH (42,000 chips per minute), while the placement speed of SOP components is 30,000 CPH (30,000 SOP components per minute). In addition, its placement accuracy is also very high, with a placement accuracy of ±50 microns for chip components and a narrow pitch placement capability of 0.1 mm (0603) and 0.15 mm (1005).
Scope of application and performance
Samsung SMT 4101 is suitable for components of various sizes, from the smallest 0402 chip to the largest 14 mm IC components. Its PCB board size range is wide, ranging from a minimum of 50 mm × 40 mm to a maximum of 510 mm × 460 mm (single rail mode) or 510 mm × 250 mm (dual rail mode). In addition, the equipment is suitable for a variety of PCB thicknesses, ranging from 0.38 mm to 4.2 mm.
Other features and advantages
Samsung SMT 411 also has the following features and advantages:
Flying Vision Centering System: Adopts Samsung's patented On The Fly recognition method to achieve high-speed placement.
Dual Cantilever Structure: Improves the stability and placement accuracy of the equipment.
High-precision placement: Able to maintain a high precision of 50 microns during high-speed placement.
Number of feeders: Up to 120 feeders, convenient and efficient material management.
Low energy consumption: Has an extremely low material loss rate of only 0.02%.
Weight: The equipment weighs 1820 kg and its dimensions are 1650 mm × 1690 mm × 1535 mm.
These features make the Samsung SMT 411 highly competitive in the market and suitable for various high-precision and high-efficiency production needs.