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Semiconductor equipment
immltu bo>Meeshaalee semiconductor > Meeshaalee Die Bonding >
‌ASM die bonder AD819

ASM kan bonder AD819

ASM die bonder AD819 meeshaa paakeejii semiconductor sadarkaa olaanaa qabuu fi chips sirritti substrates irratti kaa’uuf gargaaru yoo ta’u adeemsa automated die bond keessatti meeshaa ijoodha

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Gaaffii Saffisaa Email:smt-sales6@gdxinling.cn
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ASM die bonder AD819 meeshaa paakeejii semiconductor sadarkaa olaanaa qabuu fi chips sirritti substrates irratti kaa’uuf gargaaru yoo ta’u adeemsa automated die bond keessatti meeshaa ijoodha

AD819 Series Guutummaatti Ofumaan ASMPT Die Bonding System

Amaloota

●Dandeettii adeemsa paakeejii TO-can

●Sirrummaa ± 15 μm @ 3s

●Adeemsa hidhata daayi yuutektikii (AD819-LD) .

●Adeemsa boondii daayiin kennuu (AD819-PD) .

28.ASMPT fully automatic die bonding system

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