Comprehensive introduction of Han's Laser HFM-K series lasers
I. ଉତ୍ପାଦ ସ୍ଥିତିକରଣ
HFM-K series is a high-precision fiber laser cutting system launched by Han's Laser (HAN'S LASER), designed for high-speed cutting of thin plates and precision parts processing, especially suitable for 3C electronics, medical equipment, precision hardware and other fields with extremely high requirements for cutting accuracy and efficiency.
2. Core role and market positioning
1. Main industrial uses
3C electronics industry: precision processing of mobile phone middle frames and tablet computer metal parts
Medical devices: cutting of surgical instruments and implant metal components
Precision hardware: processing of watch parts and micro connectors
New energy: precision forming of power battery tabs and battery shells
2. Product differentiation positioning
Comparison items HFM-K series Traditional cutting equipment
Processing objects 0.1-5mm thin plates 1-20mm general plates
Precision requirements ±0.02mm ±0.1mm
Production beat Ultra-high-speed continuous production Conventional speed
3. Core technical advantages
1. Ultra-precision cutting capability
Positioning accuracy: ±0.01mm (driven by linear motor)
Minimum line width: 0.05mm (precision hollow patterns can be processed)
Heat-affected zone: <20μm (protecting the microstructure of the material)
2. High-speed motion performance
Maximum speed: 120m/min (X/Y axis)
Acceleration: 3G (industry top level)
Frog jump speed: 180m/min (reduce non-processing time)
3. Intelligent process system
Visual positioning:
20 million pixel CCD camera
Automatic identification positioning accuracy ±5μm
Adaptive cutting:
Real-time monitoring of cutting quality
Automatic adjustment of power/air pressure parameters
IV. Detailed explanation of key functions
1. Precision machining function package
Function Technical realization
Micro-connection cutting Automatically retain 0.05-0.2mm micro-connection to prevent micro-parts from splashing
Burr-free cutting Special airflow control technology, cross-section roughness Ra≤0.8μm
Special-shaped hole cutting Supports 0.1mm ultra-small hole processing, roundness error <0.005mm
2. ମୂଳ ହାର୍ଡୱେର୍ ବିନ୍ୟାସ
Laser source: single-mode fiber laser (500W-2kW optional)
Motion system:
Linear motor drive
Grating scale feedback with resolution of 0.1μm
କଟା ମୁଣ୍ଡ:
Ultra-lightweight design (weight <1.2kg)
Automatic focusing range 0-50mm
3. ସାମଗ୍ରୀ ଅନୁକୂଳନକ୍ଷମତା
Applicable material thickness:
Material type Recommended thickness range
Stainless steel 0.1-3mm
Aluminum alloy 0.2-2mm
Titanium alloy 0.1-1.5mm
Copper alloy 0.1-1mm
V. Typical application cases
1. Smart phone manufacturing
Processing content: stainless steel middle frame contour cutting
Processing effect:
Cutting speed: 25m/min (1mm thickness)
Right angle accuracy: ±0.015mm
No subsequent polishing requirements
2. Medical stent cutting
Processing requirements:
Material: NiTi memory alloy (0.3mm thick)
Minimum structural size: 0.15mm
Equipment performance:
No deformation of heat affected zone after cutting
Product yield>99.5%
3. New energy battery processing
Pole ear cutting:
Copper foil (0.1mm) cutting speed 40m/min
No burrs, no melt beads
VI. Technical parameter comparison
Parameters HFM-K1000 Japanese competitor A German competitor B
Positioning accuracy (mm) ±0.01 ±0.02 ±0.015
Minimum hole diameter (mm) 0.1 0.15 0.12
Acceleration (G) 3 2 2.5
Gas consumption (L/min) 8 12 10
VII. ଚୟନ ସୁପାରିଶଗୁଡ଼ିକ
HFM-K500: Suitable for R&D/small batch high-precision processing
HFM-K1000: Main model for 3C electronics industry
HFM-K2000: Medical/new energy mass production
VIII. Service Support
Process Laboratory: Provides material testing services
Quick response: National 4-hour service circle
Intelligent operation and maintenance: Cloud monitoring of equipment status
The HFM-K series has become a benchmark equipment in the field of precision micro-machining through the triple advantages of precision machinery + intelligent control + special technology, and is particularly suitable for advanced manufacturing fields with strict requirements on processing quality.