mpm momentum btb smt solder paste printer

Mafotokozedwe ndi magawo a chosindikizira cha MPM Momentum BTB solder phala ndi motere:

Kusamalira substrate:

Kukula kwakukulu kwa gawo lapansi: 609.6mmx508mm (24"x20")

Kuchepa kwa gawo lapansi: 50.8mmx50.8mm (2"x2")

Makulidwe a gawo lapansi: 0.2mm mpaka 5.0mm (0.008" mpaka 0.20")

Kulemera kwa gawo lapansi: 4.5kg (9.92lbs)

Chilolezo cham'mphepete mwa gawo lapansi: 3.0mm (0.118 ”)

Chilolezo chapansi: 12.7mm (0.5”) muyezo, configurable kwa 25.4mm (1.0”)

Kutsekereza kwa substrate: Chotchinga chapamwamba, chotsekera patebulo, EdgeLoc ( loko m'mphepete) (njira)

Njira zothandizira gawo laling'ono: Chowumitsira patebulo, zikhomo zojambulira maginito, zikhomo za vacuum ejector, midadada yothandizira, zida zodzipatulira (zida zochepa) kapena Grid-Lok (njira)

Zosintha zosindikiza:

Malo osindikizira kwambiri: 609.6 mmx508mm (24"x20")

Sindikizani kutulutsa: 0mm mpaka 6.35mm (0" mpaka 0.25")

Liwiro losindikiza: 0.635mm/sekondi mpaka 304.8mm/mphindi (0.025in/mphindi mpaka 12in/mphindi)

Kuthamanga kosindikiza: 0 mpaka 22.7kg (0lb mpaka 50lbs)

Kukula kwa chimango cha stencil: 737mmx737mm (29"x29") Zolembapo zazing'ono zomwe zilipo

Mtundu wokhazikika: Mawonekedwe amtundu wamba (zogwirizana ndi SMEMA), mapepala / zotsegulira

Makina a kamera: Kamera imodzi ya digito, MPM yokhala ndi zovomerezeka m'mwamba / pansi

Kuyanjanitsa kulondola ndi kubwerezabwereza: ± 12.5 microns (± 0.0005") @6σ, Cpk ≥ 2.0*

Zosindikiza zenizeni za solder phala kubwereza: ±20 microns (±0.0008") @6σ, Cpk ≥ 2.0*

Nthawi yozungulira: Momentum 9 masekondi muyezo wa BTB, 7.5 masekondi muyezo wa Momentum HiE BTB

Kufunika kwa mphamvu: 200 mpaka 240VAC (± 10%) gawo limodzi @50/60Hz, 15A

Kufunika kwa mpweya woponderezedwa: 100 psi

Mafotokozedwe ndi magawowa akuwonetsa mwatsatanetsatane zizindikiro zaumisiri ndi deta yogwira ntchito ya MPM Momentum BTB solder paste printer, yomwe ili yoyenera pazinthu zosiyanasiyana zopangira zamagetsi.