SAKI 3D SPI 3Si LS2 ndi 3D solder phala yoyendera dongosolo, makamaka ntchito kudziwa mtundu wa solder phala yosindikiza pa matabwa osindikizidwa dera (PCBs).
Zofunikira zazikulu ndi zochitika zogwiritsira ntchito
SAKI 3Si LS2 ili ndi izi:
Kulondola kwambiri: Imathandiza kusamvana katatu kwa 7μm, 12μm ndi 18μm, koyenera kuzindikiritsa phala la solder.
Thandizo lamtundu waukulu: Imathandizira kukula kwa board board mpaka mainchesi 19.7 x 20.07 (500 x 510 mm), oyenera zochitika zosiyanasiyana zogwiritsira ntchito.
Yankho la Z-axis: Ntchito yowongolera mutu ya Z-axis Optical mutu imatha kuyang'ana zida zapamwamba, zida zopindika ndi ma PCBA pamiyeso, ndikuwonetsetsa kuti zida zapamwamba zapezeka.
Kuzindikira kwa 3D: Imathandizira mitundu ya 2D ndi 3D, yokhala ndi miyeso yayikulu kwambiri mpaka 40 mm, yoyenera pazigawo zovuta zokwera pamwamba.
Mafotokozedwe aukadaulo ndi magawo amachitidwe
Mafotokozedwe aukadaulo ndi magwiridwe antchito a SAKI 3Si LS2 akuphatikiza:
Kusamvana: 7μm, 12μm ndi 18μm
Kukula kwa board: Kufikira mainchesi 19.7 x 20.07 (500 x 510 mm)
Kutalika kwakukulu kwa muyeso: 40 mm
Kuthamanga kozindikira: 5700 mamilimita masikweya pamphindikati
Kuyika kwa msika ndikuwunika kwa ogwiritsa ntchito
SAKI 3Si LS2 imayikidwa pamsika ngati njira yowunikira kwambiri ya 3D solder paste pamafakitale omwe amafunikira kuzindikira mwatsatanetsatane. Kuwunika kwa ogwiritsa ntchito kukuwonetsa kuti dongosololi limagwira ntchito bwino pakuzindikira kulondola komanso kuchita bwino, ndipo limatha kupititsa patsogolo luso la kupanga komanso mtundu wazinthu.