IRON Die Bonding Machine Datacon 8800

High-Precision, High-Efficiency Die Bonding Solution

TheIRON Datacon 8800ndi makina apamwamba kwambiri opangira ma semiconductor omwe amapangidwa kuti azipaka semiconductor, ma CD a LED, komanso kupanga zida zamagetsi mwatsatanetsatane. Ndiukadaulo wake wapamwamba, Datacon 8800 imapereka njira zofulumira komanso zolondola zamitundu yosiyanasiyana ya chip ndi gawo lapansi, ndikupangitsa kuti ikhale yoyenera kugwiritsidwa ntchito popanga zamagetsi.

Die Bonding Machine Key Features:

• High-Precision Vision Alignment System: Kuwongolera zokha kumawonetsetsa kuti njira iliyonse yolumikizirana ndi kufa ndiyolondola komanso yopanda zolakwika.

• Modular Design: Zosintha zosinthika, zololeza kutengera zomwe mukufuna.

• Kukwanitsa Kupanga Mwachangu: Kugwira ntchito mwachangu komanso kosasunthika, koyenera kupanga kuchuluka kwambiri.

• Automated Process Control: Njira zowongolera mwanzeru zimachepetsa kulowererapo kwa anthu ndikuwongolera kukhazikika kwa kupanga.

Mapulogalamu:

Datacon 8800 imagwiritsidwa ntchito kwambiri musemiconductor ma CD, ma CD a LED, komanso kupanga zinthu zamagetsi, makamaka m'malo omwe amafunikira kulumikizana kolondola kwambiri.

Die Bonding Machine Yoyenera:

• Packaging Yaing'ono ndi Yaikulu ya Chip: Kaya mukuchita ndi tchipisi tating'ono kapena magawo akulu, Datacon 8800 imapereka mayankho odalirika a kufa.

• Zosiyanasiyana Zamagetsi Zamagetsi: Ndibwino kuti mulumikizane bwino ndi zida zamagetsi monga ma module amagetsi, ma LED, masensa, ndi zina zambiri.

Datacon 8800, yomwe ili ndi mphamvu zambiri, yolondola, komanso yosinthasintha, ndi gawo lofunika kwambiri pamizere yamakono yopangira misonkhano yamagetsi, kuthandiza makasitomala kupititsa patsogolo ntchito zopanga ndikuonetsetsa kuti zinthu zili bwino.

Besi Datacon 8800 ndi makina apamwamba kwambiri omangira chip, omwe amagwiritsidwa ntchito makamaka paukadaulo wapa 2.5D ndi 3D, makamaka TSV (Kudzera pa Silicon Via).

Zaukadaulo ndi madera ogwiritsira ntchito

Besi Datacon 8800 chip bonding makina amatengera thermocompression bonding tekinoloje, yomwe ndi ukadaulo wofunikira muukadaulo wamakono wapackage wa 2.5D/3D. Ubwino wake waukulu ndi:

Tekinoloje yolumikizira ya Thermocompression: yoyenera kulongedza kwa 2.5D ndi 3D, makamaka mapulogalamu a TSV.

Mutu wofunikira wa 7-axis: mutu wofunikira wokhala ndi nkhwangwa 7, wopatsa kulondola kwambiri komanso kusinthasintha.

Kukhazikika kwapang'onopang'ono: imakhala ndi kukhazikika kopanga bwino komanso zokolola zambiri.

Magawo a magwiridwe antchito ndi nsanja yogwirira ntchito

Besi Datacon 8800 chip bonding makina ali ndi magawo otsatirawa ndi nsanja yogwirira ntchito:

Mutu wa kiyi wa 7-axis: uli ndi nkhwangwa 3 zoyikira (X, Y, Theta) ndi nkhwangwa 4 zomangira (Z, W), zomwe zimapereka malo olondola komanso kuwongolera komangiriza.

Zomangamanga Zapamwamba za Hardware: Mutu wapadera wa 7-axis ndi zomangamanga zapamwamba zimatsimikizira kumveka bwino kwambiri.

Control Platform: Pulatifomu yowongolera m'badwo watsopano wokhala ndi kuwongolera koyenda kwambiri komanso kutsika kwapang'onopang'ono, kuwongolera njira zowongolera komanso kuthekera kotsata njira zosiyanasiyana.

Kugwiritsa Ntchito Makampani ndi Kuyika Msika

Besi Datacon 8800 chip bonding makina ali ndi ntchito zosiyanasiyana mu 2.5D ndi 3D ma CD, makamaka mu kafukufuku ndi chitukuko cha high-bandwidth memory (HBM) ndi AI chips, hybrid bonding teknoloji wakhala njira yofunika kukwaniritsa m'badwo wotsatira. ya HBM (monga HBM4). Chifukwa cha kulondola kwake komanso kukhazikika kwapamwamba, zidazi zimagwira ntchito bwino pamapulogalamu a TSV ndipo zakhala chida chothandizira pakugwiritsa ntchito TSV pano.