Makina a MRSI Systems Die Bonding Machine

MRSI Systems die bonders ndi chopangidwa ndi Mycronic Group, chomwe chimayang'ana kwambiri popereka machitidwe odziwikiratu, olondola kwambiri, komanso osinthika kwambiri pakugwiritsa ntchito mosiyanasiyana mumakampani a optoelectronics. MRSI Systems 'die bonders ali ndi izi zazikulu ndi zopindulitsa:

Kulondola Kwambiri ndi Kusinthasintha: Magulu a MRSI-H amafa amapereka kulondola kwa ma 1.5 micron die bond, oyenera kupanga kuchuluka kwambiri, kusakanikirana kwakukulu, kusinthasintha kwapadera komanso kudalirika. MRSI-S-HVM die bonder imatha kusintha zokha pakati pa ± 0.5 micron ndi ± 1.5 micron zolondola zamitundu, zoyenera kuyika pamlingo wa semiconductor wafer-level, kuthandizira ma chip ambiri, kupanga njira zambiri.

Kuthamanga Kwambiri komanso Kuchita Bwino Kwambiri: Magulu a MRSI-HVM omwe amamwalira amadziwika kuti ndi omwe amatsogolera pagulu loyamba pamakampani opanga kuthamanga kwambiri, kolondola kwambiri ndi liwiro lawo lotsogola, "zero time" kusinthana pakati pa nozzles, ndi zosakwana. 1.5 micron die bond yolondola.

Ukadaulo Wapamwamba ndi Kapangidwe: The MRSI-HVM die bonder imagwiritsa ntchito mitu iwiri yokhala ndi setifiketi, malo owotcherera a eutectic, makina osinthira zero-time nozzle, mawonekedwe onyamula mpweya komanso makina ena opangira ma multilevel multi-function parallel process kuti zitsimikizire kugwira ntchito bwino. MRSI-705 die bonder imagwiritsa ntchito ma encoder okwera kwambiri komanso ukadaulo wonyamula mpweya kuti akwaniritse malo othamanga, olondola, otsekeka, ndipo kuyika kwa chip kumafika +/- 8 ma microns.

Wide Application Fields: MRSI Systems 'die bonders' amagwiritsidwa ntchito kwambiri mu optical communications and data center devices/modules, microwave ndi RF zipangizo, lasers high-power, Lidar ndi AR/VR ndi zina optoelectronic masensa. Kuphatikiza apo, ndiyabwinonso pazida zopanda pake, mabwalo ophatikizika, MEMS ndi ntchito zina.

Kayendetsedwe ka Msika ndi Kuwunika kwa Ogwiritsa: MRSI Systems ili ndi udindo wofunikira pamsika wapadziko lonse lapansi, ndipo omwe akupikisana nawo akulu ndi Besi, Yamaha Robotic Holdings, KAIJO corporation ndi AKIM Corporation. Zogulitsa za MRSI Systems zapambana kuzindikirika kwa ogwiritsa ntchito ambiri komanso gawo la msika chifukwa chodalirika kwambiri, kuthamanga kwambiri komanso kusinthasintha kwakukulu.

Mwachidule, a MRSI Systems 'die bonders akhala othandiza kwambiri pamakampani opanga ma optoelectronics ndi kulondola kwambiri, kuthamanga kwambiri, kusinthasintha, komanso ntchito zosiyanasiyana.