Semiconductor equipment
Fully automatic die bonding and flip chip system AD838L plus

Kumangirira kokwanira kokwanira ndi flip chip system AD838L kuphatikiza

AD838l kuphatikiza ma disk bonding ndi flip chip system ndi njira yolondola kwambiri komanso yogwira mtima kwambiri, yomwe imagwiritsidwa ntchito popanga makina opangira ma semiconductor ndi tchipisi. Dongosolo lili ndi mbali yayikulu yotsatirayi

State: Zogwiritsidwa ntchito wofkud: pit pafupi Tok Det: intanaka
Chen

Chiyambi chatsatanetsatane:

AD838L-plus

Makina omangira okhazikika ophatikizika ndi flip chip system


■ Kutha kunyamula zinthu zamtundu wonyamulira, makamaka zoyenera 8'' zosalimba komanso zopendekeka


■Zhuanli ndondomeko luso, +25μm/+15um_mmwamba kulondola akhoza kukhalabe mkulu ola mphamvu kupanga 12K/H.


■Kutha kugwira ntchito ndi zinthu zokha (posankha)


■ Makina odzaza mkate ndi kutsitsa (posankha)


■Atomatic switching nozzles 4 (posankha)


■ FC flip chip processing kuthekera (posankha)


■Utsireni chimbale chomatira popoperapo kale (posankha)


■1 chowerengera barcode (chosasankha), pa intaneti (chosasankha)


■ Thandizani kudyetsa m'mbuyo kuti mugwiritse ntchito zinthu zophatikizika


■ Linear motor driven XY double glue system, yomwe imagwiritsidwa ntchito popanga ma phala osiyanasiyana asiliva, zomatira zopangira kapena zopanda conductive.


■ Dongosolo la mkono wowotcherera la nozzle lilowa m'malo mwa chip chowongolera tebulo lawafa

 

 

 


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