SD8312 ya ASMPT's SD8312 automatic solder die bonder system ndi chipangizo chapamwamba chomwe chimapangidwira 12-inch wafer processing, chomwe chili ndi mphamvu zotsogola zotsogola kwambiri komanso liwiro lotsogolera kufa. Dongosololi ndiloyenera semicon yamphamvu
SD8312 kwathunthu basi zofewa malata ASM kufa bonder dongosolo
Mawonekedwe
●Mbadwo watsopano wa SD8312 umakhazikitsa muyeso watsopano wa 12” soft tin die bonder
●Mapangidwe a Universal worktable, otha kunyamula mafelemu a lead olemera kwambiri
●High-speed die bonder yophatikizira umisiri waukadaulo wapamwamba komanso wokhwima
● Kuwongolera mwatsatanetsatane kuchuluka kwa okosijeni panthawi yolumikizana
● AB wafer processing mphamvu
oe Ngawoyge Huudindo erekiti opeAnthu AI iraitaosiPart fe Temerekzapadmwana Part kuchokera CDC ek.
kuti bo inu tire
tseland Part tsinu gaiPart mweaka wokhD enemalatengchidanakichi zapadofuinda itawosTranslation wabsintha akuchpit.
iti lomwe Ah tiraamulusan. iricho:golo Suyenesoamulmakamaka
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