SIPLACE placement machine-Siemens placement machine specifications and models SIPLACE X3S technical parameters

SIPLACE placement machine X series placement machine (Simens placement machine)

Siemens placement machine SIPLACE X3S

1. Machine characteristics: SIPLACE X3 S

2. Number of cantilevers: 3

3.IPC speed: 78,100cph

4. SIPLACE benchmark evaluation: 94,500cph

5. Theoretical speed: 127,875cph

6. Machine size: 1.9x2.3m

7. Mounting head characteristics: MultiStar

8. Component range: 01005-50x40mm

9. Mounting accuracy: ±41μm/3σ(C&P) ±34μm/3σ(P&P)

10. Angular accuracy: ±0,4°/3σ(C&P) ±0,2°/3σ(P&P)

11. Maximum component height: 11.5mm

12. Mounting force: 1,0-10 Newtons

13. Conveyor belt type: single track, flexible double track

14. Conveyor mode: asynchronous, synchronous

15. PCB format: 50x50mm-850x560mm

16. PCB thickness: 0.3-4.5mm (other sizes can be customized upon request)

17. PCB weight: maximum 3kg

18. Component supply and material supply

19. Feeder capacity: 160 8mmX feeder modules

20. Feeder module type:

SIPLACE component cart, SIPLACE matrix tray feeder (MTC), waffle tray (WPC5/WPC6),

JTF-S/JTF-MSIPLACE, X feeder, Tray plate, vibrating tube, vibrating feeder, customized OEM feeder module

21, Pickup rate: ≥99,95%

22, DPM rate: ≤3dpm

23. Lighting level: 6 levels of illumination

24. Note: Machine size is only for the main body of the equipment.

PCB format: Extended input and output rails allow board lengths up to 850mm

The above is the introduction of Siemens placement machine SIPLACE X3S brought to you by Geekvalue Industrial!

Geekvalue Industrial is an innovative technology enterprise whose main business is full-chain intelligent services for patch machine equipment. We are based in Shenzhen, 

the core city of the Guangdong-Hong Kong-Macao Greater Bay Area, and have been working hard for more than ten years. As a foundation, with a professional team as 

the core and high-quality service as a guarantee, we will dig deep into the industry pain points and user needs in the global patch machine field, and continue to explore 

and explore more professional market segments and cutting-edge technological innovation fields.