SMT Parts
DISCO Multifunctional Laser ORIGAMI XP

DISCO Multifungsi Laser ORIGAMI XP

DISCO ORIGAMI XP bukan laser tunggal, tetapi sistem pemprosesan ketepatan laser mewah yang menyepadukan sumber laser, kawalan gerakan, kedudukan visual dan perisian pintar

Negeri:Baru Dalam stok:have Garanti:supply
Perincian

DISCO ORIGAMI XP is not a single laser, but a high-end laser precision processing system that integrates laser source, motion control, visual positioning and intelligent software, and is specially designed for the micro-processing needs of semiconductor, electronics and other industries. The following is a voice analysis of its core features:

1. Essence: Multifunctional laser processing platform

It is not an independent laser, but a complete set of processing equipment, including:

Laser source: optional conventional (UV) nanosecond laser (355nm) or infrared (IR) picosecond laser (1064nm).

Operation motion platform: nanometer-level positioning (±1μm).

AI visual system: automatic identification and arrangement of processing positions.

Specialized software: supports complex path programming and real-time monitoring.

2. Fungsi teras

(1) Ultra-high precision processing

Processing accuracy: ±1μm (equivalent to 1/50 of a hair).

Minimum feature size: up to 5μm (such as microholes on chips).

Applicable materials: silicon, glass, ceramics, PCB, flexible circuits, etc.

(2) Multi-process compatibility

Cutting: instant wafer cutting (no chipping), full glass cutting.

Minor: micro-holes (<20μm), blind holes (such as TSV silicon through-holes).

Surface treatment: laser cleaning, microstructure processing (such as optical components).

(3)Automated control

AI visual positioning: automatic identification of marking points, correction of material position deviation.

Adaptive processing: real-time adjustment of laser parameters according to material thickness/reflectivity.

3. Technical highlights

Features Advantages of ORIGAMI XP Comparison with traditional equipment

Laser selection UV+IR optional, adapt to different materials usually only supports a single wavelength

Thermal impact control Picosecond laser (almost no thermal damage) Nanosecond laser is prone to material ablation

Automated loading and unloading + closed-loop control requires manual intervention, low efficiency

Yield guarantee Real-time detection + automatic compensation Depends on manual sampling

4. Senario aplikasi biasa

Semiconductor: wafer cutting (SiC/GaN), chip packaging (RDL wiring).

Electronics: PCB micro-hole array, flexible circuit (FPC) cutting.

Display panel: special-shaped cutting of mobile phone glass cover.

Medical: precision processing of cardiovascular stents.

5. Why choose ORIGAMI XP?

Integrated solution: additional positioning/vision system needs to be purchased.

High yield: AI reduces personnel as workpieces and is suitable for mass production.

Future compatibility: can be equipped with new processes by upgrading the laser source.

Ringkasan

DISCO ORIGAMI XP is a leisure laser processing system for high-end manufacturing. Its core value lies in:

Precision crushes traditional equipment (μm level).

High degree of automation (from positioning to processing operations).

Wide material compatibility (brittle materials + metals + polymers).

3.HAMAMATSUF Lasers ORIGAMI XP

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