Semiconductor equipment
 ‌ASM die bonder AD819

ASM te piri AD819

Ko te ASM die bonder AD819 he taputapu whakakakahu semiconductor matatau e whakamahia ana hei whakanoho tika i nga maramara ki runga i nga taputapu, he taputapu matua i roto i te tukanga here mate aunoa.

State: Kua whakamahia have supply
_Wāhi:

Ko te ASM die bonder AD819 he taputapu whakakakahu semiconductor matatau e whakamahia ana hei whakanoho tika i nga maramara ki runga i nga taputapu, he taputapu matua i roto i te tukanga here mate aunoa.

AD819 Raupapa Aunoa ASMPT Die Bonding System

Ngā āhuatanga

●TO-kanohi te kaha tukatuka tākai

●Te tika ± 15 µm @ 3s

●Tukanga here mate Eutectic (AD819-LD)

●Tuhinga here here mate (AD819-PD)

28.ASMPT fully automatic die bonding system

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Kupu utu

aru i a matou

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