Amplitude Amaanyi Amangi Laser Satsuma X

Amplitude Satsuma X ye layisi ya disiki ennyimpi ey’amaanyi amangi ennyo eyatongozebwa kkampuni ya Amplitude eya Bufalansa. Ekozesa tekinologiya ow’enkyukakyuka eya thin-disk amplifier okutuuka ku kilowatt-level average power output ate nga ekuuma femtosecond pulse accuracy, okuddamu okunnyonnyola ensalo y’amaanyi g’amakolero ultrafast processing.

2. Omusingi gw’emirimu ogw’okumenyawo

1. Enzimba ya amplifier eya thin-slice

Gain medium: Yb:YAG crystal ekitundu ekigonvu (obugumu <200μm)

Omugerageranyo gw’obuwanvu bw’okungulu/obunene gukubisaamu emirundi 100 egya layisi z’emiggo ez’ennono

Awagira okupampagira okuyita mu ngeri nnyingi (okuggyamu amaanyi 16)

Ebirungi ebiri mu kuddukanya ebbugumu:

Ebbugumu erikyukakyuka <0.1°C/mm (layisi z’omuggo ez’ekinnansi >5°C/mm)

Theoretical thermal lens effect esemberera ziro

2. Enkola y’okugaziya emitendera mingi

Ensibuko y’ensigo: fiber oscillator (obugazi bwa pulse <300fs)

Omutendera ogw’okugaziya nga tegunnabaawo: enkola ya fiber CPA (pulse stretching to 2ns) .

Omutendera omukulu ogwa amplifier: amplifier ey’okuyita ennyo ey’ebitundu ebigonvu (amasoboza ga pulse emu >50mJ)

Compressor: grating pair enyigiriza emabega femtosecond pulses

3. Tekinologiya w’okufuga mu kiseera ekituufu

Enkola y’amaaso (adaptive optical system):

Endabirwamu ekyukakyuka etereeza okukyusakyusa mu maaso g’amayengo (obutuufu λ/10) .

Okuzuula omukka mu kiseera ekituufu (okugatta tekinologiya wa FROG) .

Enzirukanya y’amaanyi mu ngeri ey’amagezi:

Otomatiki okutereeza pulse train parameters okusinziira ku material reflectivity

Okukyukakyuka kw’amaanyi <±0.8% (essaawa 8 ez’okukola obutasalako) .

III. Enkizo ezikulembedde mu makolero

1. Bbalansi y’amaanyi n’obutuufu

Parameters Satsuma X HP3 Layisi ya disiki ey’ekinnansi

Amaanyi aga wakati 1kW 500W

Amasoboza g’omukka ogumu 50mJ 20mJ

Sipiidi y’okulongoosa ekipande kya aluminiyamu 15m/min (0.1mm obuwanvu) 8m/min

Zooni ekoseddwa ebbugumu <5μm <10μm

2. Okumenyawo mu kukozesebwa mu makolero

7×24 okukola okutambula obutasalako:

Wettanire dizayini etaliimu kalaamu ow’amaaso (anti-vibration>5G)

MTBF y’ebitundu ebikulu>essaawa 30,000

Enkola ey’amagezi ey’okuddaabiriza:

Okujjukiza okuddaabiriza okuteebereza (okusinziira ku AI algorithm) .

Okukyusa modulo (ebitundu by’amaaso

3. Ebirungi mu kukola ebintu

Okulongoosa ebyuma ebitangaaza ennyo:

Omugerageranyo gw’obuziba n’obugazi bw’okuweta ekikomo gwa 20:1 (teknologiya owa bulijjo <10:1)

Okusala zaabu foil nga tewali bimuli bisaanuuse (speed>20m/min)

Okulongoosa ebintu mu ngeri entangaavu:

Glass munda okukyusa omutindo okufuga obutuufu ±0.5μm

Okusala safiro taper <0.1°

IV. Ensonga eza bulijjo ez’okukozesa

1. Okukola bbaatule z’amaanyi amapya

Okusala amatu mu bikondo:

8μm ekikomo foil okusala sipiidi ya 30m/min

Etaliimu bbugumu ku mabbali (Ra<0.5μm) .

Okuweta ebisusunku bya bbaatule:

Aluminium alloy welding okuyingira kwa mm 10

Obuziba <0.01% .

2. Eby’omu bwengula

Ekinnya ekinyogoza ekiwujjo kya ttabiini:

Micropores za alloy ez’ebbugumu eringi (Φ50μm omugerageranyo gw’obuziba ku dayamita 50:1)

Tewali layeri ya recast (obulamu bw’obukoowu bweyongera emirundi 3)

Okulongoosa ebintu ebikoleddwa mu bikozesebwa:

Okusala kwa CFRP okutali kwa delamination (ekitundu ekikoseddwa ebbugumu <3μm) .

3. Ebyuma ebikozesebwa mu byuma bikalimagezi ebituufu

Enkola ya circuit ekyukakyuka:

PI film okusala obutuufu ±2μm

Obugazi bwa layini obutono 15μm

Okupakinga kwa semiconductor:

Obulung’amu bw’okulongoosa mu ndabirwamu okuyita mu kinnya (TGV) bweyongera emirundi 5

V. Ebirungi by’okugeraageranya eby’ekikugu

Ebintu ebigeraageranya Satsuma X Omuvuganya wa Amerika Omuvuganya mu Girimaani

Amaanyi agasobola okulinnyisibwa 1.5kW design 800W ekkomo erya waggulu 1kW ekkomo erya waggulu

Pulse flexibility 0.1-10ps adjustable Obugazi bwa pulse obutakyukakyuka Okutereeza okutono

Ekigere 1.2m2 2m2 1.8m2

Omugerageranyo gw’amaanyi agakozesebwa 1.0 1.3 1.2

VI. Enkola y’okuwagira empeereza

Laabu z’ensi yonna ezikola ku by’okukozesa: Bufalansa/Amerika/Japan/China (Shanghai)

Enkola enkulaakulana package: Ewa 100+ material processing parameter libraries

Okuzuula okuva ewala: Okugonjoola ebizibu mu kiseera ekituufu eky’omukutu gwa 5G

Satsuma X yagonjoola bulungi ekizibu kya "thermal bottleneck" ekya layisi ez'amangu ennyo mu kisaawe ky'amaanyi amangi ng'ayita mu kugatta okw'amaanyi okwa tekinologiya w'okugaziya firimu ennyimpi n'okufuga okw'amagezi, era n'afuuka ekintu ekikyusa amakolero ag'obukodyo ng'eby'omu bwengula n'amaanyi amapya. Dizayini yaayo eya modulo era etereka ekifo eky’ekikugu okusobola okulongoosa mu biseera eby’omu maaso okutuuka ku kW 1.5.