EO Nanosecond Layisi y’embeera enkalu EF40

EO (EdgeWave) laser EF40 omulimu n'omulimu okunnyonnyola mu bujjuvu

EO EF40 ye layisi ey’amaanyi amangi, ey’okuddiŋŋana ennyo mu nanosecond Q-switched solid-state laser ekozesa tekinologiya wa semiconductor pumping (DPSS) era nga nnungi nnyo mu makolero precision machining, laser marking, micro-drilling n’okunoonyereza kwa ssaayansi. Ebirungi byayo ebikulu biri mu maanyi ga pulse amangi, omutindo gwa beam omulungi ennyo n’okukola dizayini y’obulamu obuwanvu, nga kino kituukira ddala ku mbeera ezirina ebyetaago ebinene eby’obutuufu bw’ebyuma n’okutebenkera.

1. Emirimu emikulu

(1) Amaanyi amangi & amaanyi ga pulse aga waggulu

Amaanyi aga wakati: 40 W (@1064 nm), ebika ebimu bisobola okutuuka ku 60 W.

Amasoboza ga pulse emu: okutuuka ku 2 mJ (okusinziira ku sipiidi y’okuddiŋŋana).

Omuwendo gw’okuddiŋŋana: 1–300 kHz (okutereezebwa), okutuukiriza ebyetaago eby’enjawulo eby’okukola.

(2) Omutindo gwa beam omulungi ennyo

M2 < 1.3 (okumpi n’ekkomo ly’okuwunyiriza), ekifo ekitono eky’okussa essira, amasoboza agakuŋŋaanyiziddwa.

Gaussian beam, esaanira okukola micromachining ey’obutuufu obw’amaanyi.

(3) Okufuga omukka mu ngeri ekyukakyuka

Obugazi bwa pulse obutereezebwa: 10–50 ns (omuwendo ogwa bulijjo), okulongoosa enkola y’okulongoosa ebintu eby’enjawulo.

External trigger: ewagira TTL/PWM modulation, ekwatagana n’enkola z’okufuga ez’otoma.

(4) Okwesigamizibwa okw’omutindo gw’amakolero

All-solid-state design (tewali ppampu ya ttaala), obulamu >essaawa 20,000.

Air cooling oba water cooling optional, kwatagana n’embeera z’emirimu ez’enjawulo.

2. Ebitundu ebikulu eby’okukozesa

(1) Okukozesa ebyuma ebitonotono mu ngeri entuufu

Okusala ebintu ebimenyamenya: endabirwamu, safiro, seramiki (okukosebwa kw’ebbugumu okutono).

Micro drilling: PCB circuit boards, entuuyo z’amafuta, ebitundu by’ebyuma (obutuufu obw’amaanyi).

Okuggyawo firimu ennyimpi: obutoffaali bw’enjuba, ITO conductive layer etching.

(2) Okussaako obubonero bwa layisi & okukuba ebifaananyi

Obubonero bw’ekyuma: ekyuma ekitali kizimbulukuse, aloy ya aluminiyamu, aloy ya titanium (enjawulo ya waggulu).

Okuyiwa mu buveera/seramiki: tewali kaboni, emimwa emitangaavu.

(3) Okunoonyereza n’okugezesa mu bya ssaayansi

LIBS (laser induced breakdown spectroscopy): pulasima y’okusikirizibwa kw’amasoboza amangi (high-energy pulse excitation plasma) okwekenneenya elementi.

Laser Radar (LIDAR): okuzuula empewo, okutegeera okuva ewala.

(4) Obusawo n’obulungi

Obujjanjabi bw’olususu: okuggyawo langi, okuggyawo ttatu (532 nm model is better).

Okukozesa amannyo: okuggyamu ebitundu ebikalu, okwerusa amannyo.

3. Ebipimo by’ebyekikugu (emiwendo egya bulijjo) .

Ebipimo EF40 (1064 nm) EF40 (532 nm, eky’okwesalirawo)

Obuwanvu bw’amayengo 1064 nm 532 nm (emirundi ebiri) .

Amaanyi aga wakati 40 W 20 W

Amasoboza g’okukuba 2 mJ (@20 kHz) 1 mJ (@20 kHz) .

Omuwendo gw’okuddiŋŋana 1–300 kHz 1–300 kHz

Obugazi bw’omukka 10–50 ns 8–30 ns

Omutindo gw’ebikondo (M2) <1.3 <1.5

Enkola y’okunyogoza Okunyogoza empewo/okunyogoza amazzi Okunyogoza empewo/okunyogoza amazzi

4. Okugeraageranya ebintu ebivuganya (EF40 vs. fiber/CO2 laser) .

Erimu EF40 (DPSS) Fiber laser layisi ya CO2

Obuwanvu bw’amayengo 1064/532 nm 1060–1080 nm 10.6 μm

Amasoboza g’omukka (pulse energy) Waggulu (mJ level) Wansi (μJ–mJ) Waggulu (naye nga gakuba nnyo ebbugumu) .

Omutindo gw’ebikondo M2 <1.3 M2 <1.1 M2 ~1.2–2

Ebintu ebikozesebwa Ekyuma/ebitali byuma Ebyuma Ebisinziira ku kyuma Ebitali byuma (obuveera/ebiramu)

Ebyetaago by’okuddaabiriza Kitono (okupampagira okutaliimu ttaala) Kitono nnyo Okwetaaga okutereeza ggaasi/lensi

5. Mu bufunze ebirungi ebirimu

Amasoboza ga pulse amangi: gasaanira okukola ennyo nga okusima n’okusala.

Omutindo gw’ebikondo omulungi ennyo: micromachining entuufu (M2<1.3).

Okutebenkera okw’omutindo gw’amakolero: dizayini yonna ey’embeera enkalu, obulamu obuwanvu, obutaliimu ndabirira.

Obuwanvu bw’amayengo obuwerako obuliwo: 1064 nm (infrared) ne 532 nm (green light) buliwo okusobola okutuukagana n’ebintu eby’enjawulo.

Amakolero agakola:

Okukola ebyuma eby’amasannyalaze (PCB, semiconductor) .

Okukola ebyuma mu ngeri entuufu (endabirwamu, eby’obuziba) .

Okugezesa okunoonyereza kwa ssaayansi (LIBS, LIDAR) .

Obulungi bw’obujjanjabi (obujjanjabi bw’olususu, obujjanjabi bw’amannyo