mpm momentum ekyuma ekikuba ebitabo ku screen

Ebikwata ku nkola n’ebipimo bya MPM Momentum solder paste printer bye bino wammanga:

Enkwata ya substrate:

Sayizi ya substrate esinga obunene: 609.6mmx508mm (24”x20”)

Sayizi ya substrate esinga obutono: 50.8mmx50.8mm (2”x2”)

Obugumu bwa substrate: 0.2mm okutuuka ku 5.0mm (0.008” okutuuka ku 0.20”)

Obuzito obusinga obunene mu substrate: 4.5kg (9.92lbs)

Obuwanvu bw’empenda za substrate: 3.0mm (0.118”)

Obuwanvu wansi: 12.7mm (0.5”) standard, okuteekebwateekebwa okutuuka ku 25.4mm (1.0”)

Okusiba wansi: Okusiba waggulu okunywevu, okufuuwa entebe, enkola y’okusiba ku mabbali ga EdgeLoc

Enkola z’okuwagira substrate: bench vacuum, magnetic ejector pins, vacuum ejector pins, support blocks, ekintu ekiweereddwayo eky’okwesalirawo (less tooling) oba Grid-Lok ey’okwesalirawo

Ebipimo by’okukuba ebitabo:

Ekifo ekisinga okukuba ebitabo: 609.6mmx50 8mm (24"x20")

Okufulumya okukuba ebitabo: 0mm okutuuka ku 6.35mm (0" okutuuka ku 0.25")

Sipiidi y’okukuba ebitabo: 0.635mm/sec okutuuka ku 304.8mm/sec (0.025in/sec-12in/sec)

Puleesa y’okukuba ebitabo: 0 okutuuka ku 22.7kg (0lb okutuuka ku 50lbs)

Template frame size: 737mmx737mm (29"x29") Okwesalirawo okutereezebwa template frame oba obutono template sayizi okwesalirawo

Ebiraga eby’ekikugu: Obutuufu bw’okukwatagana n’okuddiŋŋana: ±12.5 microns (±0.0005”) @6σ, Cpk≥2.0 Okuddiŋŋana kw’ekifo ky’okukuba ebitabo ekya solder paste entuufu okusinziira ku kukakasa enkola y’okugezesa ey’ekibiina eky’okusatu: ±20 microns (±0.0008”) @6σ, Cpk≥ 2.0 12 Ebiraga eby’ekikugu ebirala: Amaanyi ageetaagisa: 200 okutuuka ku 240VAC (±10%) single phase @50/60Hz, 15A Ebyetaago by’empewo enyigirizibwa: 100 psi Ebiragiro bino n’ebipimo biraga omulimu gw’ekikugu mu bujjuvu ogwa MPM Momentum solder paste printer, esaanira ebyetaago eby’enjawulo eby’okukola ebyuma.