mpm momentum btb smt ekyuma ekikuba ebitabo ekya solder paste

Ebikwata ku nkola n’ebipimo bya MPM Momentum BTB solder paste printer bye bino wammanga:

Enkwata ya substrate:

Sayizi ya substrate esinga obunene: 609.6mmx508mm (24”x20”)

Sayizi ya substrate esinga obutono: 50.8mmx50.8mm (2”x2”)

Obugumu bwa substrate: 0.2mm okutuuka ku 5.0mm (0.008” okutuuka ku 0.20”)

Obuzito obusinga obunene mu substrate: 4.5kg (9.92lbs)

Obuwanvu bw’empenda za substrate: 3.0mm (0.118”)

Obuwanvu wansi: 12.7mm (0.5”) standard, okuteekebwateekebwa okutuuka ku 25.4mm (1.0”)

Okusiba wansi: Okusiba waggulu okunywevu, empewo y’emmeeza, EdgeLoc (okusiba ku mabbali) (eky’okulonda)

Enkola z’okuwagira substrate: Table vacuum, magnetic ejector pins, vacuum ejector pins, support blocks, ebinyweza ebyetongodde (ebikozesebwa ebitono) oba Grid-Lok (option)

Ebipimo by’okukuba ebitabo:

Ekifo ekisinga okukuba ebitabo: 609.6 mmx508mm (24"x20")

Okufulumya okukuba ebitabo: 0mm okutuuka ku 6.35mm (0" okutuuka ku 0.25")

Sipiidi y’okukuba: 0.635mm/sec okutuuka ku 304.8mm/sec (0.025in/sec okutuuka ku 12in/sec)

Puleesa y’okukuba ebitabo: 0 okutuuka ku 22.7kg (0lb okutuuka ku 50lbs)

Sayizi ya fuleemu ya stencil: 737mmx737mm (29"x29") Stencil entonotono ziriwo

Ekika kya fiducial: Fiducials eziri mu ngeri ya mutindo (ezigoberera SMEMA), pads/openings

Enkola ya kkamera: Kkamera emu eya digito, enkola ya MPM patented up/down vision system

Obutuufu bw’okukwatagana n’okuddiŋŋana: ± 12.5 microns (±0.0005") @6σ, Cpk ≥ 2.0*

Okuddiŋŋana ekifo ky'okukuba ekyuma ekisiiga solder ekituufu: ± 20 microns (±0.0008") @6σ, Cpk ≥ 2.0 *

Obudde bw’okutambula: Momentum 9 sikonda standard ku BTB, 7.5 seconds standard ku Momentum HiE BTB

Amaanyi ageetaagisa: 200 okutuuka ku 240VAC (±10%) phase emu @50/60Hz, 15A

Ekyetaagisa empewo enyigirizibwa: 100 psi

Ebiwandiiko bino n’ebipimo biraga ebiraga eby’ekikugu mu bujjuvu n’ebikwata ku nkola ya MPM Momentum BTB solder paste printer, esaanira ebyetaago eby’enjawulo eby’okukola ebyuma.