ekyuma kya parmi spi hs70 smt

Ekyuma ekikebera solder paste ekya PARMI SPI HS70 mulembe mupya ogw’ebyuma ebikebera solder paste ebyatongozebwa PARMI, okusinga ebikozesebwa mu mulimu gw’okukebera mu ngeri ya 3D precision. Ebyuma bino bigatta obumanyirivu bwa PARMI obw’amaanyi ne tekinologiya ow’omulembe mu tekinologiya ow’okukebera. Kirungi nnyo okwogera nti eriko RSC_6 Sensor, ekikendeeza nnyo ku budde bw’okukebera. Era ekozesa Sensor bbiri eza RSC nga zikuza lenzi emirundi 0.42 n’emirundi 0.6, nga zino zisobola okutereezebwa okusinziira ku mpisa z’ebintu okusobola okulongoosa sipiidi n’obutuufu.

Ebikwata ku by’ekikugu n’ebintu ebikola

Enkola y’okukebera: SPI HS70 ekwata enkola y’okukebera mu ngeri ya linear motor scanning okwewala okukankana okuteetaagisa mu nkola y’okukebera, ekifuula ekyuma okubeera ekinywevu mu nkola y’okukebera n’okwongezaayo obulamu bwa Hardware bw’ekyuma.

Enkola y'okuyimiriza: Dizayini ya "Down clamping" efuula substrate okubeera ennywevu mu mbeera y'okuyimirira era n'erongoosa obutuufu bw'okukebera.

Dizayini y’olutindo: Dizayini ya SPI HS70D Dual Lane ewagira okutereeza obugazi bw’olutindo 2, 3, ne 4, era esobola okulaga okunyweza olutindo 1, 3 oba 1, 4, ekyongera okukyukakyuka n’okutebenkera kw’ekyuma

Ebipimo by’ebyekikugu ebya PARMI-SPI-HS70 bye bino wammanga:

Sayizi: 430x350mm, obuwanvu mm 4, obuzito 800kg. Okusalawo: Sipiidi ya 20x10um okusalawo eri 80cm2/sec, 13x7um okusalawo sipiidi eri 40cm2/sec. Obusobozi bw’okuzuula: Esobola okuzuula paadi za solder entono ennyo, nga paadi za solder eza 100um. Enkola y’okuzuula: Ekozesa okuzuula ekyuma ekiyitibwa linear motor scanning detection, ekitajja kuleeta kukankana okuteetaagisa mu kiseera ky’enkola, okukakasa nti ekyuma kinywevu. Okwanguyiza okuddaabiriza: Waya za mmotoka zonna ziri mu bbokisi ya ddulaaya esereka mu maaso, ekirungi okuddaabiriza n’okuddaabiriza, era emirimu gy’okuddaabiriza gisobola okukolebwa ng’ekyuma kikola. Dizayini ya track bbiri: Ewagira dizayini z’olutindo 2, 3, ne 4, era obugazi bw’olutindo busobola okutereezebwa, ekisaanira ensengeka za layini z’okufulumya ez’enjawulo. Ebipimo bino eby’ekikugu biraga nti PARMI-SPI-HS70 ye kyuma ekikola obulungi ennyo eky’okuzuula ekikuta kya solder ekisaanira ebyetaago by’okufulumya eby’obutuufu obw’amaanyi.