SPI TR7007SIII ye kyuma ekikebera okukuba ebitabo mu ngeri ya solder paste ekola obulungi ennyo nga kirimu ebintu ebikulu n’emirimu gino wammanga:
Sipiidi y’okukebera: TR7007SIII erina sipiidi y’okukebera okutuuka ku 200 cm2/sec, ekigifuula emu ku byuma ebisinga okukebera okukuba solder paste mu mulimu guno.
Obutuufu bw’okukebera: Ekyuma kino kiwa okwekebejja okujjuvu okwa 3D nga kiriko okusalawo okutuuka ku 10 μm, era kirina eky’okukebera eky’obutuufu obw’amaanyi mu layini ekitaliimu kisiikirize.
Ebintu eby’ekikugu: TR7007SIII eriko omulimu gwa closed loop, tekinologiya wa 2D imaging alongooseddwa, automatic board bending compensation function ne stripe light scanning technology okukakasa nti ebiva mu kwekebejja bituufu. Ng’oggyeeko ekyo, ekyuma kino era kirina enkola ya ‘dual-track architecture’, ekyongera okulongoosa obusobozi bwa layini y’okufulumya.
Enkola y’emirimu: Enkola ya TR7007SIII nnyangu era nnyangu okukola pulogulaamu n’okukola, era esobola okuleeta omuwendo ogusinga obunene ku layini y’okufulumya.
Ensonga z’okusaba:
Okukebera mu butuufu obw’amaanyi: Kirungi eri amakolero g’okukola ebyuma ebyetaagisa okwekebejja mu ngeri entuufu naddala ku byetaago ebikakali ku buwanvu bwa solder paste n’obumu mu nkola y’okufulumya.
Okugatta layini z’okufulumya: Olw’obusobozi bwayo obw’amaanyi n’obusobozi bw’okuzuula obulungi, TR7007SIII esobola okugattibwa mu layini z’okufulumya eziriwo awatali buzibu okutumbula obulungi bw’okufulumya okutwalira awamu n’omutindo gw’ebintu.
Enfo y’akatale n’amawulire agakwata ku bbeeyi:
Okuteeka akatale: TR7007SIII eteekeddwa ng’ekyuma eky’omulembe eky’okuzuula, ekisaanira bakasitoma abalina ebyetaago eby’amaanyi eby’okuzuula obutuufu n’obulungi.
Ebikwata ku bbeeyi: Bbeeyi entongole yeetaaga okwebuuzibwako okusinziira ku byetaago bya bakasitoma. Ebiseera ebisinga bbeeyi y’ebyuma eby’omulembe ejja kuba waggulu nnyo, naye okusinziira ku mutindo gwabyo ogw’amaanyi n’emigaso gy’okufulumya egy’ekiseera ekiwanvu, amagoba ku nsimbi eziteekeddwamu gasingako