Ekyuma ekisala wafer ekya DISCO DFL7341

Ekyuma ekisala wafer ekya DISCO: Ekyuma ekisala wafer mu ngeri etalabika nga kya layisi DFL7341 kissa essira ku layisi eya infrared ng’erina obuwanvu bw’amayengo nga 1300nm munda mu wafer ya silicon okusobola okukola layeri ekyusiddwa, n’oluvannyuma n’egabanya wafer mu mpeke nga egaziya firimu n’enkola endala okutuuka ku kwonooneka okutono, obutuufu obw’amaanyi, n’ebikolwa eby’okusala eby’omutindo ogwa waggulu. Enkola eno ekola layeri ekyusiddwa yokka munda mu wafer ya silikoni, enyigiriza okutondebwa kw’ebisasiro ebirongoosa, era esaanira sampuli ezirina ebyetaago by’obutundutundu obw’amaanyi.

Obutuufu obw’amaanyi n’obulungi obw’amaanyi: DFL7341 yeettanira tekinologiya ow’okulongoosa mu ngeri enkalu, tekyetaagisa kuyonja, era esaanira okulongoosa ebintu ebiziyiza omugugu obubi. Obugazi bw’ekisenge kyayo eky’okusala buyinza okuba obufunda ennyo, ekiyamba okukendeeza ku kkubo ly’okusala. Disiki ekola erina obutuufu obw’amaanyi, obutuufu bwa X-axis linear buli ≤0.002mm/210mm, Y-axis linear accuracy buli ≤0.003mm/210mm, ate Z-axis positioning accuracy eri ≤0.001mm. Sipiidi y’okusala eri mm 1-1000/s, ate okusalawo kw’ebipimo kuli 0.1 micron.

Obunene bw’okukozesa: Ebyuma bino bisinga kukozesebwa kusala wafers za silicon nga sayizi esinga obunene tesukka yinsi 8. Esaanira okusala wafers za silicon ennongoofu nga zirina obuwanvu bwa mm 0.1-0.7 ate nga n’empeke zisukka mm 0.5. Obubonero bwa dicing oluvannyuma lw’okusala buba nga microns ntono, era tewali kugwa kw’empenda oba okwonooneka kw’okusaanuuka ku ngulu n’emabega wa wafer.

Ebipimo by’eby’ekikugu: Enkola ya DFL7341 ey’okusala mu ngeri etalabika nga layisi erimu ekyuma ekisitula kaseti, ekitambuza, enkola y’okukwataganya, enkola y’okukola, enkola y’emirimu, ekiraga embeera, yingini ya layisi, ekiwujjo n’ebitundu ebirala. Sipiidi y’okusala mu X-axis eri mm 1-1000/s, Y-axis dimensional resolution eri 0.1 micron, ate sipiidi y’okutambula eri mm 200/s; okusalawo kw’ebipimo bya Z-axis kuli 0.1 micron, ate sipiidi y’okutambula eri mm 50/s; ekifo ekitereezebwa mu Q-axis kiri diguli 380.

Ensonga z’okukozesa: DFL7341 esaanira amakolero ga semiconductor naddala mu nkola y’okupakinga chip, ekiyinza okukakasa obutuufu n’obutebenkevu bw’okupakinga chip, okutumbula obusobozi bw’okukola chip, n’okulongoosa obulungi bw’okufulumya. Mu bufunze, ekyuma ekisala ekya DISCO DFL7341 kikola kinene mu makolero ga semiconductor ne electronics. Okuyita mu tekinologiya waayo ow’okusala mu ngeri ey’obwegendereza n’obulungi obw’amaanyi, ekakasa omutindo n’okukola obulungi ebintu.