Ebikwata ku nsonga eno
Diameter: Diameter ya waya ekwata zaabu etera okuba wakati wa mm 0.02 ne 0.05, ate diameter ya ultra-fine gold alloy bonding wire etuuse ku mm 0.015.
Ebitonde: Ekitundu ekikulu ekya waya ekwata zaabu ye zaabu, ng’obulongoofu buba 99.999%, era kiyinza okuteekebwamu ffeeza, palladium, magnesium, ekyuma, ekikomo, silikoni n’ebintu ebirala.
Okukozesa: Waya ya zaabu ekwatagana ekozesebwa nnyo mu tekinologiya w’okupakinga semiconductor okusiba chip interfaces ne substrate interfaces.