Ekyuma kya SIPLACE CA kyuma kya hybrid placement ekyatongozebwa ASMPT, ekisobola okutuukiriza enkola zombi eza semiconductor flip chip (FC) ne chip attachment (DA) ku kyuma kye kimu.
Ebikwata ku by’ekikugu n’ebipimo by’omutindo gw’emirimu
Ekyuma kya SIPLACE CA kirina sipiidi y’okuteeka chips eziwera 420,000 buli ssaawa, resolution ya mm 0.01, feeder eziwerako 120, ate nga kyetaagisa amasannyalaze ga 380V12. Okugatta ku ekyo, SIPLACE CA2 erina obutuufu obutuuka ku 10μm@3σ ate sipiidi y’okukola ya chips 50,000 oba SMD 76,000 buli ssaawa.
Ebitundu by’okusaba n’okuteekebwa kw’akatale
Ekyuma kya SIPLACE CA kirungi nnyo mu mbeera z’okufulumya ezeetaaga okukyukakyuka okw’amaanyi n’emirimu egy’amaanyi, gamba ng’okukozesa mu mmotoka, ebyuma bya 5G ne 6G, ebyuma ebigezi, n’ebirala Nga kigatta SMT ey’ekinnansi ne bonding ne flip chip assembly, SIPLACE CA erongoosa ebivaamu bya okupakinga okw’omulembe, okutumbula okukyukakyuka, okukola obulungi, okukola n’omutindo, era okukekkereza obudde bungi, ssente n’... ekifo.
Akatale ne Tekinologiya Ensibuko
Engeri ebikozesebwa mu mmotoka, 5G ne 6G, ebyuma ebigezi n’ebyuma ebirala bingi bwe byetaaga ebitundu ebitono era eby’amaanyi, okupakinga okw’omulembe kufuuse emu ku tekinologiya omukulu. Ebyuma bya SIPLACE CA bitondekawo emikisa emipya eri abakola ebyuma by’amasannyalaze nga bayita mu nsengeka yaabwe ekyukakyuka ennyo n’enkola erongooseddwa, okuggulawo obutale obupya n’ebibinja bya bakasitoma ebipya, okukendeeza ku nsaasaanya n’okwongera ku bikolebwa.
Mu bufunze, ebyuma bya SIPLACE CA bye bisinga okulondebwa abakola ebyuma eby’amasannyalaze olw’omutindo gwabyo ogw’amaanyi, okukyukakyuka okw’amaanyi n’emirimu egy’amaanyi naddala mu mbeera z’okufulumya ezeetaaga okugatta okw’amaanyi n’okupakinga okw’omulembe