DDI>Ebyuma bya semiconductor > Ebikozesebwa mu Kusiba Die >

Ekyuma ekikwatagana ne MRSI Systems Die

MRSI Systems Die Bonder kiva mu kibiina kya Mycronic Group, ekissa essira ku kuwa enkola za die bonding ezikola mu ngeri ey’otoma mu bujjuvu, ezituufu ennyo, ezikyukakyuka ennyo, ezikozesebwa ennyo mu mulimu gw’amasannyalaze g’amaaso

State:Ekozesebwa In stock:have supply

Okusaba okw'amangu Email:smt-sales6@gdxinling.cn

Ebikwata ku ddyo

MRSI Systems die bonders biva mu Mycronic Group, essira erisinga kulissa ku kuwa enkola za die bond ezikola mu bujjuvu mu ngeri ey’otoma, ezituufu ennyo, era ezikyukakyuka ennyo mu mirimu egy’enjawulo mu mulimu gw’amasannyalaze g’amaaso. Die bonders za MRSI Systems zirina ebikulu bino wammanga n’emigaso:

MAR

High Precision and Flexibility: MRSI-H series die bonders ziwa 1.5 micron die bond accuracy, ezisaanira okukola high-volume, high-mix production, nga zirina okukyukakyuka okw’enjawulo n’okwesigamizibwa. MRSI-S-HVM die bonder esobola okukyusa mu ngeri ey’otoma wakati wa ±0.5 micron ne ±1.5 micron accuracy modes, esaanira okupakinga semiconductor wafer-level, okuwagira multi-chip, multi-process production.

Sipiidi ya waggulu n'obulungi obw'amaanyi: MRSI-HVM series die bonders zimanyiddwa nga die bonders ez'omutindo ogusooka ezikulembedde mu makolero olw'okufulumya sipiidi ey'amaanyi, mu ngeri entuufu ennyo nga zirina sipiidi yazo ekulembedde, "zero time" switching between nozzles, and less than 1.5 micron die bond obutuufu.

Tekinologiya ow’omulembe n’okukola dizayini: MRSI-HVM die bonder ekozesa emitwe ebiri egya patent, siteegi z’okuweta emirundi ebiri egy’ekika kya eutectic, enkola y’okukyusa entuuyo ezitali za budde bwa zero, dizayini ya bbeeri z’empewo enzijuvu n’ebirala eby’emitendera mingi ebikola emirimu mingi mu ngeri ey’obwengula ey’obwengula okukakasa nti ekola bulungi nnyo. MRSI-705 die bonder ekozesa high-resolution linear encoders ne air bearing technology okutuuka ku mangu, precise, closed-loop positioning, era obutuufu bw’okuteeka chip butuuka ku +/- 8 microns.

Ebifo ebigazi eby’okukozesa: Die bonders za MRSI Systems zikozesebwa nnyo mu mpuliziganya y’amaaso n’ebyuma/modules za data center, ebyuma bya microwave ne RF, laser ez’amaanyi amangi, Lidar ne AR/VR ne sensa endala ez’amasannyalaze ag’amaaso. Okugatta ku ekyo, era esaanira ebyuma ebitali bimu, integrated circuits, MEMS n’emirimu emirala.

Enkola y’akatale n’okwekenneenya abakozesa: MRSI Systems erina ekifo ekikulu mu katale k’ensi yonna, era abavuganya nayo abakulu kuliko Besi, Yamaha Robotics Holdings, KAIJO corporation ne AKIM Corporation. Ebintu bya MRSI Systems biwangudde okumanyibwa kw’abakozesa bangi n’omugabo gw’akatale olw’okwesigamizibwa kwabyo okw’amaanyi, sipiidi ya waggulu n’okukyukakyuka okw’amaanyi.

Mu bufunze, MRSI Systems’ die bonders zifuuse eky’okugonjoola ekikulu eri amakolero g’amasannyalaze g’amaaso n’obutuufu bwazo obw’amaanyi, sipiidi ya waggulu, okukyukakyuka, n’okukozesebwa okw’enjawulo.