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Semiconductor equipment
DDI>Ebyuma bya semiconductor > Ebikozesebwa mu Kusiba Die >
ASMPT high-precision fully automatic die bonding machine AD280 Plus

ASMPT high-precision fully automatic ekyuma ekikwatagana okufa AD280 Plus

Ebirimu●Obutuufu ± 3 μm @ 3s●Okugaba glue/jetting for die bonding●Material source traceability for enhanced quality control●Okukola dizayini y’omutwe gwa soldering eriko patent●Okutuuka ku 8” x 8” okukwata substrate●Ebyokulonda●Flip chip capaability●UV curingDimensionsW x D x H2,150

State:Ekozesebwa In stock:have supply
Okusaba okw'amangu Email:smt-sales6@gdxinling.cn
Ebikwata ku ddyo

Die bonder ya high-precision fully automatic die bonder AD280 Plus ye automated high-precision die bonder nga erina ebikulu n’emirimu gino wammanga:

Okuteeka mu kifo mu ngeri ey’obutuufu obw’amaanyi: AD280 Plus erina tekinologiya ow’okutegeera ebifaananyi mu ngeri ey’okutunuulira, asobola okutuuka ku butuufu bw’okuteeka mu kifo kya XY obwa ±3 μm@3σ.

Obusobozi bw’okukwata ebintu ebingi: Ekyuma kino kiwagira okukwata ebintu ebingi, omuli wafers ku expanders oba clamping rings, optional format trays, Gelpak, tape feeders, n’ebirala.

Okulondoola: Okulongoosa okulondoola ebintu ng’oyita mu bbaakoodi, koodi za QR oba tekinologiya wa OCR ku bipande/wafers/chips.

Okufuga amaanyi ga die bond: Nga eriko sensa y’amaanyi ga die bond, empalirizo ya die bond esobola okufugibwa obulungi.

Fast UV curing: Ewagira spot curing ne panel curing, esaanira okukozesebwa nga PCB/COB transceiver packaging.

Ennimiro n’amakolero ebikola

AD280 Plus esaanira ebyuma ebipakinga IC naddala mu kupakinga eby’omulembe. Ekozesebwa nnyo mu kukola semiconductor n’enkola z’okupakinga, era esobola okulongoosa ennyo obulungi bw’okupakinga n’amakungula.

AD280-PLUS

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Adresa y'okutemamu:

No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y'okuzza embeera ya telefono:

+86 13480912606

nkalala:

smt-okutunda6@gdxinling.cn

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