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Semiconductor equipment
DDI>Ebyuma bya semiconductor > Ebikozesebwa mu Kusiba Die >
ASMPT die bonding machine fully automatic system AD8312 Plus

ASMPT die bonding ekyuma fully automatic enkola AD8312 Plus

Ebirimu● Omulembe omupya ogw’obusobozi obw’amaanyi AD8312 series die bonders ziteekawo omutindo omupya eri amakolero● Universal worktable design, esaanira okukola ku high-density lead frames● Esangibwa mu configurations eziwera okutuukiriza ebyetaago by’akatale eby’enjawulo● AD8312P

State:Ekozesebwa In stock:have supply
Okusaba okw'amangu Email:smt-sales6@gdxinling.cn
Ebikwata ku ddyo

Ye die bonder eya otomatiki mu bujjuvu eyakolebwa okukozesebwa mu nkola ya integrated circuit ne discrete component. Egatta ebirungi eby’amangu ennyo n’obutuufu obw’amaanyi, era eriko enkola y’okufuga okutonnya kwa kalaamu, esaanira okukola ku wafer die bonding eya yinsi 12.

AD8312-PLUS

Ebikulu ebirimu

Obusobozi bw’okufulumya obw’amaanyi : AD8312 series die bonder eteekawo omutindo omupya ku busobozi bw’okufulumya obw’amaanyi, nga buli ssaawa efulumya ebitundu 17,000 .

Obutuufu obw'amaanyi : Obutuufu bw'ekifo ky'okusoda mu XY buli ±20 μm @ 3σ mu mbeera ya mutindo ne ±12.5 μm @ 3σ mu mbeera y'obutuufu .

Universal workpiece table design : Esaanira okukola ku high-density lead frames, nga zirina ensengeka ez’enjawulo okutuukiriza ebyetaago by’akatale eby’enjawulo .

Enkola y’okutegeera ebifaananyi : Erimu enkola ey’omulembe ey’okutegeera ebifaananyi iFlash, erongoosa obutuufu bw’okusiba ebifaananyi 1.

Ebitundu by’okusaba

AD8312 Plus esaanira okukozesebwa mu integrated circuits ne discrete components, naddala okukola ku high-density lead frames n’ebyetaago eby’enjawulo eby’okupakinga .





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No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y'okuzza embeera ya telefono:

+86 13480912606

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smt-okutunda6@gdxinling.cn

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