Enyanjula mu bujjuvu:
Enkola ya die bonding ne flip chip mu bujjuvu mu ngeri ya otomatiki
■Obusobozi obw’enjawulo obw’okukwata ebintu obw’ekika ky’omutwala, naddala nga busaanira 8'' ebizibu era ebitera okukunya
■Zhuanli enkola tekinologiya, +25μm / + 15um_upward obutuufu akyayinza okukuuma waggulu essaawa okufulumya obusobozi 12K / H.
■Obusobozi bw'okukwata ebintu mu ngeri ey'obwengula (optional)
■Enkola y’okutikka n’okutikkula wafer mu ngeri ey’obwengula (optional)
■Entuuyo ezikyusakyusa mu ngeri ey’obwengula 4 (eky’okwesalirawo) .
■Obusobozi bw'okukola ku flip chip ya FC (eky'okwesalirawo)
■Fuuyira glue disc okusobola okufuuyira nga tonnafuuyira (optional)
■1 ekisoma bbaakoodi (eky’okwesalirawo), ku mutimbagano (eky’okwesalirawo)
■Owagira reverse feeding okukwata ebintu ebipakiddwa ebitabuddwamu core
■Linear motor driven XY double glue system, ekozesebwa ku paste za ffeeza ez’enjawulo, glues ezitambuza oba ezitatambuza
■Enkola y’omukono gw’okuweta entuuyo ezikyukakyuka ekyusa chip y’okutereeza emmeeza ya wafer ekyukakyuka