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Semiconductor equipment
DDI>Ebyuma bya semiconductor > Ebikozesebwa mu Kusiba Die >
Fully automatic ASMPT die bonding system AD832i

Enkola ya ASMPT die bonding eya otomatiki mu bujjuvu AD832i

Ebipimo n’ebipimo by’enkola ya ASMPT fully automatic die bonding system bye bino wammanga:Ebipimo: W x D x H 1,970 x 1,350 x 2,190 mm

State:Ekozesebwa In stock:have supply
Okusaba okw'amangu Email:smt-sales6@gdxinling.cn
Ebikwata ku ddyo

Enkola ya ASMPT die bonder eya fully automatic AD832I ye fully automatic high-speed silver paste die bonder ekoleddwa ku byuma ebitono era nga esobola okukwata ebika by’ebyuma eby’enjawulo nga QFN, SOT, SOIC, SOP, n’ebirala.Erina ebintu ebikulu bino wammanga :

AD832i

Obusobozi bw’okugaba ultra-micro: Esobola okukwata wafers entono ennyo, esaanira okukwata fuleemu y’omusulo eya density enkulu.

Dizayini y’omutwe gw’okuweta eriko patent: Dizayini y’omutwe gw’okuweta eriko patent erongoosa obutebenkevu n’obulungi bw’okuweta.

Enkola ya dual glue drop system: Nga eriko enkola ya dual glue drop system, esobola bulungi okufuga obungi n’obutuufu bwa glue ekozesebwa.

Ebibalo eby’ebifaananyi mu kiseera ekituufu: Enkola ya IQC eyasembyeyo egaba ebibalo eby’ebifaananyi mu kiseera ekituufu abakozesa okulondoola n’okutereeza enkola y’okufulumya.

Ebintu bino bifuula AD832i okukola obulungi mu nkola ya die bond eya yinsi 8 (mm 200), naddala esaanira embeera z’okufulumya ezeetaaga obulungi obw’amaanyi n’obutuufu obw’amaanyi.

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No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y'okuzza embeera ya telefono:

+86 13480912606

nkalala:

smt-okutunda6@gdxinling.cn

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