ASM die bonder AD819 ye kyuma eky’omulembe eky’okupakinga semiconductor ekikozesebwa okuteeka obulungi chips ku substrates era kye kyuma ekikulu mu nkola ya automated die bond
ASM die bonder AD819 ye kyuma eky’omulembe eky’okupakinga semiconductor ekikozesebwa okuteeka obulungi chips ku substrates era kye kyuma ekikulu mu nkola ya automated die bond
AD819 Series Enkola ya ASMPT Die Bonding Ekola mu bujjuvu
Ebintu eby'enjawulo
●TO-can okupakinga okulongoosa obusobozi
●Obutuufu ± 15 μm @ 3s
●Enkola ya eutectic die bond (AD819-LD) .
●Enkola y'okugaba die bond (AD819-PD) .
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