Ebikozesebwa mu Kusiba Die

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Ebyuma byaffe ebisiba die bikoleddwa yinginiya okusobola okukola obulungi, sipiidi, n’okukola ebintu bingi, ekisobozesa abakola okutumbula ebikolebwa ate nga bakuuma omutindo ogw’awaggulu. Oba okola ebyuma ebikozesebwa abantu, ebitundu by’emmotoka, oba sensa z’amakolero, ebyuma byaffe bikakasa nti bikola bulungi nnyo era byesigika.

ASM omukuumi AD819

ASM die bonder AD819 ye kyuma eky’omulembe eky’okupakinga semiconductor ekikozesebwa okuteeka obulungi chips ku substrates era kye kyuma ekikulu mu nkola ya automated die bond

State:Ekozesebwa In stock:have supply
ASM Ekyuma kya Bonder AD800

ASM AD800 ye die bonder ekola obulungi mu bujjuvu mu ngeri ya otomatiki ng’erina emirimu n’ebintu bingi eby’omulembe

State:Ekozesebwa In stock:have supply
ASM Okufa Okusiba AD50Pro

Enkola y’emirimu gya ASM die bonder AD50Pro okusinga erimu okufumbisa, okuyiringisibwa, enkola y’okufuga n’ebyuma ebiyamba.

State:Ekozesebwa In stock:have supply
ASMPT Pacific Panel Okuweta

AD420XL egaba emisinde egy’amaanyi, egy’okulonda n’okuteeka Mini LED COB solutions ku LCD BLUs ennene (for local dimming) ne ultra-fine pitch LED displays, nga zirina obusobozi bw’okukwata chip entono, ...

State:Ekozesebwa In stock:have supply
Fully automatic ASMPT soft tin die bonding ekyuma enkola

Enkola ya ASMPT eya SD8312 fully automatic soft solder die bonder system kyuma kya mulembe ekyakolebwa okukola wafer ya yinsi 12, nga erina obusobozi bw’okukola lead frame mu density enkulu n’okukulembera die bond...

State:Ekozesebwa In stock:have supply
Enkola ya ASMPT die bonding eya otomatiki mu bujjuvu AD832i

Ebipimo n’ebipimo by’enkola ya ASMPT fully automatic die bonding system bye bino wammanga:Ebipimo: W x D x H 1,970 x 1,350 x 2,190 mm

State:Ekozesebwa In stock:have supply
Enkola ya die bonding eya otomatiki mu bujjuvu ne flip chip AD838L plus

AD838l plus fully automatic disk bonding and flip chip system ye kyuma kya die bonding ekituufu era ekikola obulungi, okusinga nga kikozesebwa mu kukola otomatiki okupakinga semiconductor an...

State:Ekozesebwa In stock:have supply
ASMPT die bonding ekyuma fully automatic enkola AD8312 Plus

Ebirimu● Omulembe omupya ogw’obusobozi obw’amaanyi AD8312 series die bonders guteekawo omutindo omupya eri amakolero● Universal worktable design, esaanira okukola ku high-density lead frames● Esangibwa mu multiple...

State:Ekozesebwa In stock:have supply
ASMPT high-precision fully automatic ekyuma ekikwatagana okufa AD280 Plus

Ebifaananyi●Obutuufu ± 3 μm @ 3s●Glue dispensing/jetting for die bonding●Material source traceability for enhanced quality control●Okukola dizayini y'omutwe gw'okusoda ogulina patent●Okutuuka ku 8” x 8” okukwata substrate●Ebyokulonda●...

State:Ekozesebwa In stock:have supply
ASMPT ekyuma kya eutectic ekya otomatiki mu bujjuvu AD211 Plus

Ebirimu●Obutuufu ± 12.5 μm @ 3s●Asobola okukola butereevu ku substrates za ceramic●Okugukola enkola ne modulo design●Okufuga okwetongodde ku crystal retrieval ne crystal bonding systems●Equipped with IQC syst...

State:Ekozesebwa In stock:have supply
Ekyuma ekikwatagana ne MRSI Systems Die

MRSI Systems Die Bonder kiva mu Mycronic Group, essira erisinga kulissa ku kuwa enkola za die bonding ezikola mu bujjuvu, ezituufu ennyo, ezikyukakyuka ennyo, ezikozesebwa ennyo mu optoelectroni...

State:Ekozesebwa In stock:have supply
Ekyuma ekikwata ekyuma ekifa Datacon 8800

Besi Datacon 8800 kyuma kya mulembe ekikola chip bonding, okusinga kikozesebwa mu tekinologiya w’okupakinga mu 2.5D ne 3D naddala mu nkola ya TSV (Through Silicon Via).

State:Ekozesebwa In stock:have supply