DISCO Multifunctional Laser ORIGAMI XP

DISCO ORIGAMI XP is not a single laser, but a high-end laser precision processing system that integrates laser source, motion control, visual positioning and intelligent software, and is specially designed for the micro-processing needs of semiconductor, electronics and other industries. The following is a voice analysis of its core features:

1. Essence: Multifunctional laser processing platform

It is not an independent laser, but a complete set of processing equipment, including:

Laser source: optional conventional (UV) nanosecond laser (355nm) or infrared (IR) picosecond laser (1064nm).

Operation motion platform: nanometer-level positioning (±1μm).

AI visual system: automatic identification and arrangement of processing positions.

Specialized software: supports complex path programming and real-time monitoring.

2. ໜ້າທີ່ຫຼັກ

(1) Ultra-high precision processing

Processing accuracy: ±1μm (equivalent to 1/50 of a hair).

Minimum feature size: up to 5μm (such as microholes on chips).

Applicable materials: silicon, glass, ceramics, PCB, flexible circuits, etc.

(2) Multi-process compatibility

Cutting: instant wafer cutting (no chipping), full glass cutting.

Minor: micro-holes (<20μm), blind holes (such as TSV silicon through-holes).

Surface treatment: laser cleaning, microstructure processing (such as optical components).

(3)Automated control

AI visual positioning: automatic identification of marking points, correction of material position deviation.

Adaptive processing: real-time adjustment of laser parameters according to material thickness/reflectivity.

3. Technical highlights

Features Advantages of ORIGAMI XP Comparison with traditional equipment

Laser selection UV+IR optional, adapt to different materials usually only supports a single wavelength

Thermal impact control Picosecond laser (almost no thermal damage) Nanosecond laser is prone to material ablation

Automated loading and unloading + closed-loop control requires manual intervention, low efficiency

Yield guarantee Real-time detection + automatic compensation Depends on manual sampling

4. ສະຖານະການຄໍາຮ້ອງສະຫມັກທົ່ວໄປ

Semiconductor: wafer cutting (SiC/GaN), chip packaging (RDL wiring).

Electronics: PCB micro-hole array, flexible circuit (FPC) cutting.

Display panel: special-shaped cutting of mobile phone glass cover.

Medical: precision processing of cardiovascular stents.

5. Why choose ORIGAMI XP?

Integrated solution: additional positioning/vision system needs to be purchased.

High yield: AI reduces personnel as workpieces and is suitable for mass production.

Future compatibility: can be equipped with new processes by upgrading the laser source.

ສະຫຼຸບ

DISCO ORIGAMI XP is a leisure laser processing system for high-end manufacturing. Its core value lies in:

Precision crushes traditional equipment (μm level).

High degree of automation (from positioning to processing operations).

Wide material compatibility (brittle materials + metals + polymers).