SAKI 3D SPI 3Si LS2

SAKI 3D SPI 3Si LS2 ni sisitemu yo kugenzura paste ya 3D igurisha, ikoreshwa cyane cyane kugirango hamenyekane ubuziranenge bwibicuruzwa byacapishijwe ku mbaho ​​zicapye (PCBs).

Ibyingenzi byingenzi nibisabwa

SAKI 3Si LS2 ifite ibintu by'ingenzi bikurikira:

Ibisobanuro bihanitse: Bishyigikira imyanzuro itatu ya 7μm, 12μm na 18μm, ikwiranye no kugurisha neza-kugurisha ibicuruzwa bikenewe.

Inkunga nini nini: Shyigikira ubunini bwumuzunguruko kugeza kuri 19.7 x 20.07 (500 x 510 mm), bikwiranye nuburyo butandukanye bwo gusaba.

Igisubizo cya Z-axis: Igikorwa gishya cya Z-axis optique yo kugenzura umutwe irashobora kugenzura ibice bihanitse, ibice byavunitse hamwe na PCBAs murwego rwo hejuru, bigatuma hamenyekana neza ibice bihanitse.

Kugaragaza 3D: Gushyigikira uburyo bwa 2D na 3D, hamwe nuburebure ntarengwa bwo gupima uburebure bugera kuri mm 40, bubereye ibice bigoye byo hejuru.

Ibisobanuro bya tekiniki n'ibipimo by'imikorere

Ibisobanuro bya tekiniki n'ibipimo bya SAKI 3Si LS2 birimo:

Icyemezo: 7 mm, 12 mm na 18 mm

Ingano yubuyobozi: Ntarengwa 19.7 x 20.07 (500 x 510 mm)

Ikigereranyo ntarengwa cyo gupima uburebure: mm 40

Umuvuduko wo gutahura: milimetero kare 5700 kumasegonda

Guhagarara kw'isoko no gusuzuma abakoresha

SAKI 3Si LS2 ihagaze ku isoko nka sisitemu yo kugenzura neza ya 3D igurisha paste yo kugenzura porogaramu zikoreshwa mu nganda zisaba gutahura neza. Isuzuma ryabakoresha ryerekana ko sisitemu ikora neza mugutahura neza no gukora neza, kandi irashobora kuzamura cyane umusaruro nubuziranenge bwibicuruzwa.