Semiconductor equipment
Fully automatic ASMPT die bonding system AD832i

Byuzuye byikora ASMPT bipfa guhuza sisitemu AD832i

Ibisobanuro n'ibipimo bya ASMPT sisitemu yo gupfa byikora byikora nuburyo bukurikira: Ibipimo: W x D x H 1,970 x 1,350 x 2,190 mm

Leta: Yakoreshejwe have supply
Birambuye

Sisitemu yuzuye ya ASMPT ipfa sisitemu ya AD832I nuburyo bwuzuye bwihuta bwihuta bwa silver paste bipfa guhuza ibikoresho bito kandi birashobora gukora ubwoko bwibikoresho bitandukanye nka QFN, SOT, SOIC, SOP, nibindi bifite ibintu byingenzi bikurikira bikurikira :

AD832i

Ultra-micro yo gutanga ubushobozi: Irashobora gukora ultra-nto ya wafer, ikwiranye no gufata neza ikariso ikora.

Igishushanyo mbonera cyo gusudira cyashizweho: Igishushanyo mbonera cyo gusudira umutwe gitezimbere ituze kandi ikora neza yo gusudira.

Sisitemu ebyiri yo guta kole: Ifite ibikoresho bibiri byo guta kole, irashobora kugenzura neza ingano nukuri kwa kole yakoreshejwe.

Imibare nyayo yibishushanyo: Sisitemu IQC iheruka itanga imibare nyayo-nyayo kubakoresha kugirango bakurikirane kandi bahindure ibikorwa.

Ibi biranga bituma AD832i ikora neza murwego rwa 8-santimetero (200 mm) zipfa guhuza, cyane cyane bibereye mubidukikije bisaba gukora neza kandi neza.

Kuri Na:

Na Kuri Akamenyetso Kuri i Ibikurikira > urwego

A

Inyuma Kuri Kuri Kunozwa Imirimo na Aderesi: Icyo ari cyo cyose Gicurasi.

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Gukurikira

Na: RW Kuri i Ibya vuba, na Imirimo Kuri i Ibikurikira > urwego.

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