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Semiconductor equipment
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Fully automatic ASMPT soft tin die bonding machine system

Byuzuye byikora ASMPT yoroshye amabati apfa sisitemu yo guhuza imashini

Sisitemu ya ASMPT ya SD8312 yuzuye igurisha yoroheje igurisha sisitemu yo kugurisha ni igikoresho cyateye imbere cyagenewe gutunganya wafer ya santimetero 12, gifite ubushobozi bwo gutunganya ibintu byinshi kandi biganisha ku kwihuta. Sisitemu ikwiranye nimbaraga za semicon

Leta: Yakoreshejwe have supply
Gusaba Byihuse Email:smt-sales6@gdxinling.cn
Birambuye

Intangiriro irambuye:

SD8312 byikora byuzuye byoroheje amabati ASM apfa sisitemu yububiko

Ibiranga

Generation Ibisekuru bishya bya SD8312 bishyiraho urwego rushya rwa 12 ”yoroshye tin die bonder

Design Igishushanyo mbonera rusange gikora, gishobora gukemura amakimbirane menshi

● Byihuta byihuta bipfa guhuza udushya twinshi-tekinoroji kandi ikuze

Kugenzura neza urugero rwa ogisijeni mugihe cyo gupfa

Ubushobozi bwa AB wafer bwo gutunganya

SD8312

Kuri Na:

Na Kuri Akamenyetso Kuri i Ibikurikira > urwego

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Gukurikira

Na: RW Kuri i Ibya vuba, na Imirimo Kuri i Ibikurikira > urwego.

Ibuganya

GUHINDURA

Aderesi

No 18, Umuhanda w'inganda Shangliao, Umujyi wa Shajing, Akarere ka Baoan, Shenzhen, Ubushinwa

Telefone Umubare

+86 13480912606

imeli

smt-sales6@gdxinling.cn

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