en
id
sk
srp
swe
it
pt
ben
may
bel
nl
fra
th
vie
ru
jp
kor
de
arm
aze
bos
bul
bur
cs
dan
div
el
est
fil
fin
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
kan
kin
lao
lav
lit
ltz
lug
mao
mlt
nep
nor
nya
ori
orm
per
pl
rom
san
som
spa
swa
tam
tr
ukr
urd
wel
xho
ASM ipfa guhuza AD819 nigikoresho cyambere cyo gupakira igice cya semiconductor gikoreshwa mugushira neza chip kuri substrate kandi nigikoresho cyingenzi muburyo bwimikorere ipfa.
AD819 Urukurikirane rwuzuye Automatic ASMPT Die Bonding Sisitemu
Ibiranga
● TO-irashobora gupakira ubushobozi bwo gutunganya
Ukuri ± 15 µm @ 3s
Process Inzira ya Eutectic ipfa inzira (AD819-LD)
Gutanga inzira yo gupfa (AD819-PD)
