Han's Fibre Laser HFM-K Series

Comprehensive introduction of Han's Laser HFM-K series lasers

I. מיצוב המוצר

HFM-K series is a high-precision fiber laser cutting system launched by Han's Laser (HAN'S LASER), designed for high-speed cutting of thin plates and precision parts processing, especially suitable for 3C electronics, medical equipment, precision hardware and other fields with extremely high requirements for cutting accuracy and efficiency.

2. Core role and market positioning

1. Main industrial uses

3C electronics industry: precision processing of mobile phone middle frames and tablet computer metal parts

Medical devices: cutting of surgical instruments and implant metal components

Precision hardware: processing of watch parts and micro connectors

New energy: precision forming of power battery tabs and battery shells

2. Product differentiation positioning

Comparison items HFM-K series Traditional cutting equipment

Processing objects 0.1-5mm thin plates 1-20mm general plates

Precision requirements ±0.02mm ±0.1mm

Production beat Ultra-high-speed continuous production Conventional speed

3. Core technical advantages

1. Ultra-precision cutting capability

Positioning accuracy: ±0.01mm (driven by linear motor)

Minimum line width: 0.05mm (precision hollow patterns can be processed)

Heat-affected zone: <20μm (protecting the microstructure of the material)

2. High-speed motion performance

Maximum speed: 120m/min (X/Y axis)

Acceleration: 3G (industry top level)

Frog jump speed: 180m/min (reduce non-processing time)

3. Intelligent process system

Visual positioning:

20 million pixel CCD camera

Automatic identification positioning accuracy ±5μm

Adaptive cutting:

Real-time monitoring of cutting quality

Automatic adjustment of power/air pressure parameters

IV. Detailed explanation of key functions

1. Precision machining function package

Function Technical realization

Micro-connection cutting Automatically retain 0.05-0.2mm micro-connection to prevent micro-parts from splashing

Burr-free cutting Special airflow control technology, cross-section roughness Ra≤0.8μm

Special-shaped hole cutting Supports 0.1mm ultra-small hole processing, roundness error <0.005mm

2. תצורת חומרת ליבה

Laser source: single-mode fiber laser (500W-2kW optional)

Motion system:

Linear motor drive

Grating scale feedback with resolution of 0.1μm

ראש חיתוך:

Ultra-lightweight design (weight <1.2kg)

Automatic focusing range 0-50mm

3. יכולת הסתגלות חומרית

Applicable material thickness:

Material type Recommended thickness range

Stainless steel 0.1-3mm

Aluminum alloy 0.2-2mm

Titanium alloy 0.1-1.5mm

Copper alloy 0.1-1mm

V. Typical application cases

1. Smart phone manufacturing

Processing content: stainless steel middle frame contour cutting

Processing effect:

Cutting speed: 25m/min (1mm thickness)

Right angle accuracy: ±0.015mm

No subsequent polishing requirements

2. Medical stent cutting

Processing requirements:

Material: NiTi memory alloy (0.3mm thick)

Minimum structural size: 0.15mm

Equipment performance:

No deformation of heat affected zone after cutting

Product yield>99.5%

3. New energy battery processing

חיתוך אוזניים מוט:

Copper foil (0.1mm) cutting speed 40m/min

No burrs, no melt beads

VI. Technical parameter comparison

Parameters HFM-K1000 Japanese competitor A German competitor B

Positioning accuracy (mm) ±0.01 ±0.02 ±0.015

Minimum hole diameter (mm) 0.1 0.15 0.12

Acceleration (G) 3 2 2.5

Gas consumption (L/min) 8 12 10

VII. המלצות לבחירה

HFM-K500: Suitable for R&D/small batch high-precision processing

HFM-K1000: Main model for 3C electronics industry

HFM-K2000: Medical/new energy mass production

VIII. Service Support

Process Laboratory: Provides material testing services

Quick response: National 4-hour service circle

Intelligent operation and maintenance: Cloud monitoring of equipment status

The HFM-K series has become a benchmark equipment in the field of precision micro-machining through the triple advantages of precision machinery + intelligent control + special technology, and is particularly suitable for advanced manufacturing fields with strict requirements on processing quality.